Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Abstract Network-on-chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs …

Multicore systems are in demand due to their high performance thus making application
map** an important research area in this field. Breaking an application into multiple …

Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising
computation engine for systems like cloud computing servers, big data systems, etc …

Many-core systems connected by 3D Network-on-Chips (NoC) are emerging as a promising
computation engine for systems like cloud computing servers, big data systems, etc …

Background and Objectives: Thermal problem is one of the main challenges in 3D on-chip
networks. Inappropriate traffic distribution, poor heat dissipation, cooling restriction for layers …

3-D multiprocessor system-on-chip (MPSoC) systems can offer higher integration density,
lower interaction cost, better bandwidth, and greater performance. However, vertically …

This paper addresses the problem of performance and thermal yield maximization for hard
real-time 3D embedded chip multiprocessors. We propose a process variation-aware …

Over the past decades, the shrinking transistor size enabled more transistors to be
integrated into an IC chip, to achieve higher and higher computing performances. However …