(57) ABSTRACT A method for bonding a first copper element onto a second copper element
including forming a crystalline copper layer enriched in oxygen on each of surfaces of each …

The present disclosure includes micro-electro mechanical system (MEMS) structures and
methods of forming the same. Substrates of the MEMS structures are bonded together by …

BACKGROUND Micro-electro-mechanical systems (MEMS) has led to the creation of a wide
variety of small and fragile electrical com-20 ponents such as sensor technologies …

US PATENT DOCUMENTS(57) ABSTRACT 5,188,983 A* 2/1993 Guckel et al....................
438/53 A method of forming a device is provided A substrate having 5,458,847 A 10, 1995 …

A microelectromechanical (MEMS) device is fabricated from a wafer having a plurality of die
regions with grooves and MEMS components formed on a wafer surface at each die region …

US20090134481A1 - Molded Sensor Package and Assembly Method - Google Patents
US20090134481A1 - Molded Sensor Package and Assembly Method - Google Patents …

An apparatus and method for sensor architecture based on bulk machining of silicon wafers
and fusion bond joining which provides a nearly all-silicon, hermetically sealed …

(57) ABSTRACT A semiconductor structure includes a first device, a second device, a first
hole, a second hole, and a sealing object. The second device is contacted to the first device …

A method for packaging a microelectronic device in an hermetically sealed cavity and
managing an atmosphere of the cavity with a dedicated hole, including making said cavity …

The present disclosure includes micro-electro mechanical system (MEMS) structures and
methods of forming the same. Substrates of the MEMS structures are bonded together by …