This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

This study compares high-speed bondtesting (shear and pull) with board level drop testing
(BLDT) of BGA packages using Sn4. 0% Ag0. 5% Cu solder balls and either an ENIG or …

A detailed experimental study on the fracture mechanism of Cu–Sn intermetallic compounds
(IMCs) in the Pb-free solder was presented in this paper. The growth behaviors of the Cu 6 …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

The chip-to-chip bonding technique using Cu-pillars bump is widely applied in 3D chip
stacking technology. The excessive growth of intermetallic compounds (IMC) is expected to …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips
with Cu contact-pads on the front side and a die attach film on the backside are picked and …

The dynamic response of a microsystem based on rigid-flex printed circuit board (rigid-flex
PCB) with three layers of rigid circuit boards connected by flexible circuits was investigated …

The reliability of an electronic product in harsh applications is typically limited by the fatigue
failure of one of the interconnected solder joints. Mechanical properties of common lead-free …