Real-time full-chip thermal tracking: A post-silicon, machine learning perspective

S Sadiqbatcha, J Zhang, H Amrouch… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
In this article, we present a novel approach to real-time tracking of full-chip heatmaps for
commercial off-the-shelf microprocessors based on machine-learning. The proposed post …

Post-silicon heat-source identification and machine-learning-based thermal modeling using infrared thermal imaging

S Sadiqbatcha, J Zhang, H Zhao… - … on Computer-Aided …, 2020 - ieeexplore.ieee.org
In this article, we present a novel post-silicon approach to locating the dominant heat
sources on commercial multicore processors using heatmaps measured via an infrared (IR) …

Robust identification of thermal models for in-production high-performance-computing clusters with machine learning-based data selection

F Pittino, R Diversi, L Benini… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Power and thermal management are critical components of high-performance-computing
(HPC) systems, due to their high-power density and large total power consumption. The …

[PDF][PDF] D3. 1 Multi-criteria optimization requirements

L Nogueira, T Benz - ampere-euproject.eu
This deliverable covers the work done during the first phase of the project within WP3. The
deliverable spans 9 months' work (including 3 extra months with respect of the Grant …

[ΒΙΒΛΙΟ][B] Towards Addressing Thermal and Reliability Challenges in Nanometer Integrated Circuits

SI Sadiqbatcha - 2021 - search.proquest.com
On-chip power densities continue to increase in modern integrated circuits (IC) due to rapid
integration and feature scaling. As a consequence, today's high-performance processors …

Hardware-validated performance and power modelling of heterogeneous multi-processing architectures

M Walker - 2019 - eprints.soton.ac.uk
Modern processors are becoming increasingly more complex and utilise higher numbers of
Heterogeneous Multi-Processing (HMP) cores. Energy-efficiency has become the primary …