This paper presents a novel die-attach material for high-temperature applications based on
transient liquid phase (TLP) bonding. Cu particles are electroless plated with Sn to achieve …

Transient liquid phase bonding (TLPB) is a promising technology for three-dimensional
integration of circuits (3D IC), but it can be slow and less productive. A novel Cu-Sn …

Abstract Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils
involves, in the temperature range above the melting point of Sn (232° C) and below 350° C …

In this work, the aging treatment was carried out on full Cu 3 Sn joints at different
temperatures for various durations, the microstructure evolution, grain morphology variation …

The immoderate growth of intermetallic compound (IMC) at the Cu/Sn bonding interface
reduces the reliability of bonding joints, leading to the failure of high-density packaging …

A series of Cusingle bondSn reactions were studied for the electroless plating of Sn onto Cu
microparticles. The Cu microparticles were more temperature-sensitive than the planar Cu …

CuSn–Cu bonding is widely used in 2.5-D integration due to the ease of operation.
However, it suffers from high bond resistance due to the high resistivity of Cu–Sn …

A highly reliable three-dimensional network structure joint was fabricated based on Cu/Ni/Sn
powder with double-layer coatings and transient liquid phase bonding (TLPB) technology for …

Abstract for 5 µm diameter micro bumps, the interfacial intermetallic compounds (IMCs)
seriously affects the interconnection performance of micro bumps. In this paper, we focused …

Electroplating is one of the most common methods for applying electronic connector
coatings. This research investigated the tribological behavior of electroplated multilayer …