Estimation and measurement of junction temperatures in a three-level voltage source converter

T Bruckner, S Bernet - … Conference Record of the 2005 Industry …, 2005 - ieeexplore.ieee.org
The design of a power converter must guarantee that the operating junction temperatures
v/sub j/of all devices do not exceed their limits under all specified operating conditions …

Evaluating different implementations of online junction temperature sensing for switching power semiconductors

H Niu, RD Lorenz - IEEE Transactions on Industry Applications, 2016 - ieeexplore.ieee.org
Switching power semiconductor online junction temperature T j sensing is essential for
device switching performance evaluation, device switching control, and device lifetime …

An experimental assessment of numerical predictive accuracy for electronic component heat transfer in forced convection—part II: Results and discussion

PJ Rodgers, VC Eveloy… - J. Electron …, 2003 - asmedigitalcollection.asme.org
Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat
transfer in forced convection using a widely used computational fluid dynamics (CFD) …

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

J Lohan, P Tiilikka, P Rodgers… - IEEE Transactions on …, 2000 - ieeexplore.ieee.org
The steady state thermal performance of an isolated SO-8 package is experimentally
characterized on five thermal test printed circuit boards (PCBs) and the results compared …

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced …

J Lohan, P Tiilikka, P Rodgers… - ITHERM 2000. The …, 2000 - ieeexplore.ieee.org
As the functionality of electronic systems increase, so does the complexity of printed circuit
board (PCB) design, with greater component packing densities requiring additional internal …

[PDF][PDF] Applications of infrared thermography in electronics research

R Lehtiniemi, CM Fager, AM Hynninen, T Aapro… - … on Quantitative Infrared …, 2000 - qirt.org
In the course of time, power densities in electronics have been continuously growing. Since
excessive dissipated power leads to elevated temperatures affecting on functionality …

Assessment of thermal behavior and development of thermal design guidelines for integrated power electronics modules

YF Pang - 2005 - search.proquest.com
With the increase dependency on electricity to provide correct form of electricity for lightning,
machines, and home and office appliances, the need for the introduction of high reliability …

Thermal management for high performance integrated circuits with non-uniform chip power considerations

TD Yuan, BZ Hong, HH Chen… - … Symposium (Cat. No …, 2001 - ieeexplore.ieee.org
Thermal management for nonuniform chip power integrated circuits is studied. Circuit chip
power analysis was used to generate nonuniform chip power and computational fluid …

Transient thermal network modeling applied to multiscale systems. Part II: Application to an electronic control unit of an automobile

M Miana, C Cortés, JL Pelegay… - IEEE Transactions …, 2010 - ieeexplore.ieee.org
This paper applies the methodology of transient thermal network modelling (TTNM)
introduced in Part I to the heat transfer analysis of an electronic control unit (ECU) located in …

Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules

KK Sikka - IEEE Transactions on Components and Packaging …, 2001 - ieeexplore.ieee.org
A thermal tester has been developed for the accurate measurement of the internal thermal
resistance of high-power electronic modules. The tester is designed for the simultaneous …