Intelligent wearable devices based on nanomaterials and nanostructures for healthcare

L **e, Z Zhang, Q Wu, Z Gao, G Mi, R Wang, H Sun… - Nanoscale, 2023 - pubs.rsc.org
Emerging classes of flexible electronic sensors as alternatives to conventional rigid sensors
offer a powerful set of capabilities for detecting and quantifying physiological and physical …

Revolutionizing technology with spintronics: devices and their transformative applications

MK Yadav, R Kumar, RK Ratnesh, J Singh… - Materials Science and …, 2024 - Elsevier
The scaling of metal oxide semiconductor field effect transistors (MOSFETs) for data storing
and logic circuit operation has reached a critical point, beyond which further scaling poses …

Performance Improvement of Spacer-engineered N-type Tree Shaped NSFET towards Advanced Technology nodes

U Gowthami, AK Panigrahy, DS Rani, MN Bhukya… - IEEE …, 2024 - ieeexplore.ieee.org
Tree-shaped Nanosheet FETS (NSFET) is the most dependable way to scale down the gate
lengths deep. This paper investigates the 12nm gate length (LG) n-type Tree-shaped NSFET …

An intensive study of tree-shaped JL-NSFET: digital and analog/RF perspective

S Valasa, S Tayal, LR Thoutam - IEEE Transactions on Electron …, 2022 - ieeexplore.ieee.org
This manuscript for the first time presents the digital and analog/RF performance analysis for
novel Tree-shaped Junctionless Nanosheet (NS) FET. An additional inter-bridge (IB) …

Technology review of CNTs TSV in 3D IC and 2.5 D packaging: Progress and challenges from an electrical viewpoint

MF Abdullah, HW Lee - Microelectronic Engineering, 2024 - Elsevier
Through‑silicon via (TSV) is one of the most important features in 3D integrated circuit (IC)
and 2.5 D packaging. Both are within the advanced packaging topic for the digital and …

Enhancing ZnO/Si heterojunction photodetector performance for ultra high responsivity across wide spectral range

RK Ratnesh, MK Singh, J Singh - Journal of Materials Science: Materials …, 2024 - Springer
This study outlines strategies for the development of an ultra-high responsivity wide band
ZnO/Si-based heterojunction photodetector (PD). The incorporation of a UV-enhanced Si …

Designing CMOS compatible efficient ohmic contacts to WSi 2 N 4 via surface-engineered Mo 2 B monolayer electrodes

L Cao, X Deng, Z Tang, R Tan, YS Ang - Journal of Materials Chemistry …, 2024 - pubs.rsc.org
Forming ohmic contacts between metals and semiconductors is critical to achieving high-
performance and energy-efficient electronics. Here we investigate the interface properties of …

Three-dimensional transistors and integration based on low-dimensional materials for the post-Moore's law era

X Wang, C Liu, Y Wei, S Feng, D Sun, H Cheng - Materials Today, 2023 - Elsevier
Since the 1960s, the feature size of metal oxide semiconductor field-effect transistors has
been scaled down to sub-micrometer and even nanometer to increase the transistor density …

Carbon nanotube materials for future integrated circuit applications

Y Ze, Y Liu, B Wang, H Yin, C **, Z Zhang - Materials Today, 2024 - Elsevier
Aligned carbon nanotubes (A-CNTs) have been demonstrated to be promising materials for
constructing advanced complementary metal–oxide–semiconductor (CMOS) field-effect …

[HTML][HTML] Alzheimer's disease biomarker detection using field effect transistor-based biosensor

PG Le, SH Choi, S Cho - Biosensors, 2023 - mdpi.com
Alzheimer's disease (AD) is closely related to neurodegeneration, leading to dementia and
cognitive impairment, especially in people aged> 65 years old. The detection of biomarkers …