[HTML][HTML] Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review
M Li, L Zhang, N Jiang, L Zhang, S Zhong - Materials & Design, 2021 - Elsevier
As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …
researchers take advantage of micro/nano-sized particles or another element coated on …
[HTML][HTML] Recent advances in Sn-based lead free solder interconnects for microelectronics packaging: materials and technologies
The electronic industry faces a number of issues as a result of the rapid miniaturization of
electronic products and the expansion of application areas, with the reliability of electronic …
electronic products and the expansion of application areas, with the reliability of electronic …
Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling
L Zhang, D ** on microstructure, wettability and mechanical properties of Sn–Bi-based solder
Sn–Bi-based solder alloys have sparked tremendous research interest towards the
development of low-temperature interconnecting materials in multi-level packaging …
development of low-temperature interconnecting materials in multi-level packaging …
Critical barriers to industry 4.0 adoption in manufacturing organizations and their mitigation strategies
The fourth industrial revolution, fueled by automation and digital technology advancements,
enables us to manage manufacturing systems effectively. Its deployment in enterprises has …
enables us to manage manufacturing systems effectively. Its deployment in enterprises has …
Recent advances on SnBi low-temperature solder for electronic interconnections
SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …
[HTML][HTML] Effect of Joule heating on the reliability of microbumps in 3D IC
Due to the demand for high-performance electronic products, there has been a rapid
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …
Shear and fatigue properties of lead-free solder joints: Modeling and microstructure analysis
Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …