GaN: Processing, defects, and devices

SJ Pearton, JC Zolper, RJ Shul, F Ren - Journal of applied physics, 1999 - pubs.aip.org
The role of extended and point defects, and key impurities such as C, O, and H, on the
electrical and optical properties of GaN is reviewed. Recent progress in the development of …

Recent developments in rare-earth doped materials for optoelectronics

AJ Kenyon - Progress in Quantum electronics, 2002 - Elsevier
Rare-earth doped materials are of crucial importance to optoelectronics, and are widely
deployed in fibre amplifiers and solid-state lasers. This article summarises the present state …

[KNIHA][B] Handbook of nitride semiconductors and devices, Materials Properties, Physics and Growth

H Morkoį - 2009 - books.google.com
The three volumes of this handbook treat the fundamentals, technology and nanotechnology
of nitride semiconductors with an extraordinary clarity and depth. They present all the …

Polarization effects in nitride semiconductors and device structures

H Morkoç, R Cingolani, B Gil - Material Research Innovations, 1999 - Springer
Wide bandgap nitride semiconductors have recently attracted a great level of attention
owing to their direct bandgaps in the visible to ultraviolet regions of the spectrum as emitters …

Diamond as the heat spreader for the thermal dissipation of GaN-based electronic devices

L Sang - Functional Diamond, 2022 - Taylor & Francis
With the increasing power density and reduced size of the GaN-based electronic power
converters, the heat dissipation in the devices becomes the key issue toward the real …

Indium nitride (InN): A review on growth, characterization, and properties

AG Bhuiyan, A Hashimoto, A Yamamoto - Journal of applied physics, 2003 - pubs.aip.org
During the last few years the interest in the indium nitride (InN) semiconductor has been
remarkable. There have been significant improvements in the growth of InN films. High …

Size-dependent Eshelby's tensor for embedded nano-inclusions incorporating surface/interface energies

P Sharma, S Ganti - J. Appl. Mech., 2004 - asmedigitalcollection.asme.org
The classical formulation of Eshelby (Proc. Royal Society, A241, p. 376, 1957) for embedded
inclusions is revisited and modified by incorporating the previously excluded …

Transient electron transport in wurtzite GaN, InN, and AlN

BE Foutz, SK O'Leary, MS Shur… - Journal of applied …, 1999 - pubs.aip.org
Transient electron transport and velocity overshoot in wurtzite GaN, InN, and AlN are
examined and compared with that which occurs in GaAs. For all materials, we find that …

Fabrication and performance of GaN electronic devices

SJ Pearton, F Ren, AP Zhang, KP Lee - Materials Science and Engineering …, 2000 - Elsevier
GaN and related materials (especially AlGaN) have recently attracted a lot of interest for
applications in high power electronics capable of operation at elevated temperatures …

XPS analysis of AlN thin films deposited by plasma enhanced atomic layer deposition

P Motamedi, K Cadien - Applied Surface Science, 2014 - Elsevier
X-ray photoelectron spectroscopy has been used to investigate the properties of AlN films
deposited using a low temperature plasma-enhanced atomic layer deposition process …