On-the-fly bare die bonding based on laser induced forward transfer (LIFT)

L Overmeyer, SN Gottwald, M Springer, JF Düsing - CIRP Annals, 2022 - Elsevier
Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the
die transfer process is often the limiting time constraint due to the inertia of the mechanical …