Experimental study of thermal contacts for the enhancement of interfacial heat transfer

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Thermal metrology for deeply buried low-thermal-resistance interfaces

AU Gaitonde, JA Weibel, AM Marconnet - International Journal of Heat and …, 2025 - Elsevier
High heat fluxes generated in electronic devices must be dissipated by conduction through
the semiconductor substrate and packaging layers to avoid local high-temperature hotspots …
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