A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints

N Ismail, A Atiqah, A Jalar, MA Bakar… - Journal of Manufacturing …, 2022 - Elsevier
This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

Overview of different approaches in numerical modelling of reflow soldering applications

I Bozsóki, A Géczy, B Illés - Energies, 2023 - mdpi.com
This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

[HTML][HTML] Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

D Straubinger, B Illés, D Busek, N Codreanu… - Case Studies in Thermal …, 2022 - Elsevier
In this paper, the effect of different thermocouple constructions on the hot spot temperature
are investigated with a modelling approach to achieve more precise soldering profile …

[HTML][HTML] Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components due to the Reflow Soldering Process

N Kimaporn, C Samakkarn, J Thongsri - Processes, 2024 - mdpi.com
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat
generated by the welding tip to melt a solder ball for bonding the following essential HDD …

Pattern formation by spinodal decomposition in ternary lead-free Sn-Ag-Cu solder alloy

J Sun, H Liang, S Sun, J Hu, C Teng, L Zhao, H Bai - Metals, 2022 - mdpi.com
In comparison to Pb-based solders which have a toxic effect, the tin-silver-copper (SAC)
family of alloys have relatively strong reliability and are widely used in the electronics …

[HTML][HTML] A Feasibility Study for the Hot-Air-Assisted Reflow Soldering Process Based on Computational Fluid Dynamics

N Kanjad, C Chanbandit, J Thongsri - Processes, 2024 - mdpi.com
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) employs heat
generated at the welding tip (WT) to bond tiny electrical components for assembling an …

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

P Veselý, I Králová, D Pilnaj, M Plaček… - Advanced Engineering …, 2024 - Wiley Online Library
An intermetallic layer (IML) between the solder alloy and the soldered surface affects the
mechanical and electrical performance of the resulting joints. Numerous studies have …

Research on the Optimization Method of SMT Process Parameters Based on Improved PSO Algorithm

S Yun, X Yang, B Wang, C Ji, B Lin… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Surface mount technology (SMT) is pivotal in electronic manufacturing, with 60%-70% of
quality issues linked to solder paste printing (SPP). This paper presents a real-time …

Validation of heat-level vapor phase soldering process and workspace leakage detection with applied pressure sensors

MA Alaya, B Illés, D Bušek, A Géczy - Applied Sciences, 2021 - mdpi.com
Featured Application The paper presents the application of pressure sensors and the
obtained pressure/height profiles next to the generally used soldering temperature profiles …