A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
Overview of different approaches in numerical modelling of reflow soldering applications
This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …
soldering technology from recent years. The focus was on detailing the different process …
Enhancing Vessel Segment Extraction in Retinal Fundus Images Using Retinal Image Analysis and Six Sigma Process Capability Index
Retinal vessel segmentation, skeletonization, and the generation of vessel segments are
considered significant steps in any automated system for measuring the vessel biomarkers …
considered significant steps in any automated system for measuring the vessel biomarkers …
[HTML][HTML] Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
In this paper, the effect of different thermocouple constructions on the hot spot temperature
are investigated with a modelling approach to achieve more precise soldering profile …
are investigated with a modelling approach to achieve more precise soldering profile …
[HTML][HTML] Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components due to the Reflow Soldering Process
N Kimaporn, C Samakkarn, J Thongsri - Processes, 2024 - mdpi.com
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat
generated by the welding tip to melt a solder ball for bonding the following essential HDD …
generated by the welding tip to melt a solder ball for bonding the following essential HDD …
Pattern formation by spinodal decomposition in ternary lead-free Sn-Ag-Cu solder alloy
J Sun, H Liang, S Sun, J Hu, C Teng, L Zhao, H Bai - Metals, 2022 - mdpi.com
In comparison to Pb-based solders which have a toxic effect, the tin-silver-copper (SAC)
family of alloys have relatively strong reliability and are widely used in the electronics …
family of alloys have relatively strong reliability and are widely used in the electronics …
[HTML][HTML] A Feasibility Study for the Hot-Air-Assisted Reflow Soldering Process Based on Computational Fluid Dynamics
N Kanjad, C Chanbandit, J Thongsri - Processes, 2024 - mdpi.com
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) employs heat
generated at the welding tip (WT) to bond tiny electrical components for assembling an …
generated at the welding tip (WT) to bond tiny electrical components for assembling an …
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
An intermetallic layer (IML) between the solder alloy and the soldered surface affects the
mechanical and electrical performance of the resulting joints. Numerous studies have …
mechanical and electrical performance of the resulting joints. Numerous studies have …
Research on the Optimization Method of SMT Process Parameters Based on Improved PSO Algorithm
S Yun, X Yang, B Wang, C Ji, B Lin… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Surface mount technology (SMT) is pivotal in electronic manufacturing, with 60%-70% of
quality issues linked to solder paste printing (SPP). This paper presents a real-time …
quality issues linked to solder paste printing (SPP). This paper presents a real-time …
Validation of heat-level vapor phase soldering process and workspace leakage detection with applied pressure sensors
Featured Application The paper presents the application of pressure sensors and the
obtained pressure/height profiles next to the generally used soldering temperature profiles …
obtained pressure/height profiles next to the generally used soldering temperature profiles …