The evolution of hardness in Cu-W alloy thin films

T **e, J Zhu, L Fu, R Zhang, N Li, M Yang… - Materials Science and …, 2018 - Elsevier
A series of Cu-W films with the W content higher than 17.2 at% were prepared by magnetron
sputtering focused co-deposition technology. The micro-structures and nanoidentation …

[KÖNYV][B] Handbook of Solid State Diffusion: Volume 2: Diffusion Analysis in Material Applications

A Paul, S Divinski - 2017 - books.google.com
Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications
covers the basic fundamentals, techniques, applications, and latest developments in the …

Role of the early stages of Ni-Si interaction on the structural properties of the reaction products

A Alberti, A La Magna - Journal of Applied Physics, 2013 - pubs.aip.org
Nickel-silicon compounds, as most of the transition metal silicides, show peculiar
thermodynamic and kinetic behaviours. The reason resides in the metastability of a rich …

Self-assembled metal nano-multilayered film prepared by co-sputtering method

T **e, L Fu, W Qin, J Zhu, W Yang, D Li, L Zhou - Applied Surface Science, 2018 - Elsevier
Nano-multilayered film is usually prepared by the arrangement deposition of different
materials. In this paper, a self-assembled nano-multilayered film was deposited by …

Nanoscale Cu/Ta multilayer deposition by co-sputtering on a rotating substrate. Empirical model and experiment

CM Müller, AS Sologubenko, SSA Gerstl… - Surface and Coatings …, 2016 - Elsevier
Co-sputtering from confocal sources is a widespread technique for the production of thin film
alloys. In this process the substrate is rotated to ensure that the films are homogeneous in …

Investigation on the interfacial stability of multilayered Cu–W films at elevated deposition temperatures during co-sputtering

J Xue, Y Li, L Hao, L Gao, D Qian, Z Song, J Chen - Vacuum, 2019 - Elsevier
Cu–W nano-multilayered films show great potential applications in microelectronic, plasma
and nuclear fields due to the unique interfacial structure. In this paper, Cu–W films with …

Atom probe tomography for advanced metallization

D Mangelinck, F Panciera, K Hoummada… - Microelectronic …, 2014 - Elsevier
In microelectronics, the increase in complexity and the reduction of devices dimensions
make essential the development of new characterization tools and methodologies. Indeed …

Three dimensional distributions of arsenic and platinum within NiSi contact and gate of an n-type transistor

F Panciera, K Hoummada, M Gregoire, M Juhel… - Applied Physics …, 2011 - pubs.aip.org
Atom probe tomography was used to study the redistribution of platinum and arsenic atoms
after Ni (Pt) silicidation of As-doped polycrystalline Si. These measurements were performed …

Progress in the understanding of Ni silicide formation for advanced MOS structures

D Mangelinck, K Hoummada, F Panciera… - … status solidi (a), 2014 - Wiley Online Library
Metallic silicides have been used as contact materials on source/drain and gate in metal‐
oxide semiconductor (MOS) structure for 40 years. Since the 65 nm technology node, NiSi is …

Self-assembled binary immiscible Cu-transition metal multilayers prepared by co-sputtering deposition

T **e, L Fu, X Cao, J Zhu, W Yang, D Li, L Zhou - Thin Solid Films, 2020 - Elsevier
A series of Cu-X (X= W, Mo, Nb, Cr, V, Al) films with similar Cu content (about 50 at.%) were
prepared by dual-target co-deposition technique. By using this method, we found that the …