Power module packaging technologies have been experiencing extensive changes as the
novel silicon carbide (SiC) power devices with superior performance become commercially …

Wide bandgap (WBG) devices are a desirable choice for high-density energy conversion
systems. In high-speed hard-switching applications, voltage overshoot across device …

The double pulse test (DPT) is a widely accepted method to evaluate the dynamic behavior
of power devices. Considering the high switching-speed capability of wide band-gap …

Gallium nitride high electron mobility transistors (GaN HEMTs) are promising switching
devices in high-efficiency and high-density dc–dc converters due to their fast switching …

Increased adoption of electric vehicles, photovoltaic, and battery energy storage systems is
driving the need for high-current SiC power modules. The state-of-the-art multichip module …

With growing interests in low-inductance silicon carbide (SiC)-based power module
packaging, it is vital to focus on system-level design aspects to facilitate easy integration of …