The relationships between the structure and the dielectric properties of polyimides (PIs)
were extensively studied to construct universal correlations of dielectric constant (D k) and …

Polyimides possess excellent thermal-mechanical stability and solution processability and
can be widely used in the electronic industry. In particular, they can achieve a decent …

Polyimides (PIs) possessing both low dielectric constant (D k) and dissipation factor (D f)
remain an intriguing study for the ever-increasing demand for the high frequency …

Technological advancements are exacting futuristic materials that exhibit comprehensive
properties for diversiform applications. Cyanate Esters (CE) are promising materials that can …

Low dielectric insulating materials with good adhesive properties and flame retardance are
becoming increasingly important for achieving high-speed and low-loss communications in …

A series of polyimide/polytetrafluoroethylene (PI/PTFE) hybrid films were synthesized by
blending water‐soluble polyamide acid salts with water‐based PTFE dispersion and thermal …

At present, high-performance polymers with low dielectric constants (D k) and low
dissipation factors (D f) have gained much attention with the rapid evolution of …

Establishing a design concept for low-dielectric constant (εr) and low dissipation factor (tan
δ) polymeric materials is vital to improve signal transmission rates. Polyurea-based …

The surge of fifth-generation communication has intensified the demand for advanced
dielectric layers in flexible copper-clad laminates (FCCL). These layers must ensure a low …

An alkaline developable and negative‐type PSPI with a high sensitivity and excellent
mechanical properties based on a poly (amic acid)(PAA) and a photo‐base generator has …