The urgent need for ultrahigh thermally conductive materials to keep up with the rapid
development of the electronics industry has led to the exploration of hexagonal boron nitride …

Thermally conductive polymer nanocomposites are enticing candidates for not only thermal
managements in electronics but also functional components in emerging thermal energy …

Flexible and highly thermally conductive materials with consistent thermal conductivity (λ)
during large deformation are urgently required to address the heat accumulation in flexible …

The development of highly thermally conductive composites that combine visible
light/infrared camouflage and information encryption has been endowed with great …

With the rapid development of 5G information technology, thermal conductivity/dissipation
problems of highly integrated electronic devices and electrical equipment are becoming …

Soft self‐healing materials are compelling candidates for stretchable devices because of
their excellent compliance, extensibility, and self‐restorability. However, most existing soft …

Highly thermal conductivity materials with excellent electromagnetic interference shielding
and Joule heating performances are ideal for thermal management in the next generation of …

The demand for thermally conductive but electrically insulating materials has increased
greatly in advanced electronic packaging. To this end, polymer-based composites filled with …

Miniaturized and high‐power‐density 3D electronic devices pose new challenges on
thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is …

High-performance electromagnetic interference (EMI) shielding materials with ultraflexibility,
outstanding mechanical properties, and superior EMI shielding performances are highly …