This study utilized first-principles high-throughput computations to scrutinize the viability of Ti-
W and Ti-Ru binary alloys as diffusion barrier layers for copper interconnects. By computing …

Titanium alloys and nickel-based alloys have their own unique properties, and the bimetallic
structure composed of the two alloys can be widely used in the aerospace field. However …

Accurate thickness measurement of copper (Cu) film on silicon (Si)-based wafers is very
important in the chemical mechanical polishing (CMP) process. For thickness measurement …

CrWN coatings were fabricated through a hybrid high-power impulse magnetron
sputtering/radio-frequency magnetron sputtering technique. The phase structures …

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for
Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point …

The article considers the possibility of using the eddy current method of non-destructive
testing for the problems of measuring the electrical conductivity of thin metal films. As the …

Introducing precipitates significantly improves the strength of metallic materials. In the
present study, we elucidate the role of a precipitated Ti phase on the deformation …

The article considers the possibility of applying the eddy current method of non-destructive
testing for measuring the electrical conductivity of new material-thin metal films. Copper films …

采用铜互连的三维集成技术是提高微电子器件性能的一种很有前景的方法. 然而,
由于铜易扩散到硅电子器件中, 导致其性能降低甚至失效, 而钽(Ta) 凭借稳定的化学性能常被 …