The number of photonic components integrated into the same circuit is approaching one
million, but so far, this has been without the large-scale integration of active components …

The increasing sophistication of generative AI models requires computing performance and
energy efficiency scaling that Moore's Law scaling of transistors alone cannot deliver …

Abstract Low-temperature Cu–Cu solid-state bonding is key for interconnect miniaturization
and higher current densities in advanced semiconductor devices. Achieving reliable joints …

Estimating the reliability of electronic devices involves identification of failure mechanisms
and prediction of lifetimes. For parameter estimation and failure mode identification in …

Face-to-face bonded 3-D (F2F 3D) technology, with the potential to significantly reduce chip
area while enhancing performance, stands as one of the most promising ways to extend …

The trend for 3D heterogeneous integration drives the need for a low-temperature bonding
process for high-density interconnects (HDI). The Cu-Sn-In based solid-liquid interdiffusion …

There has been a notable transition in the electronics industry towards the heterogeneous
integration strategy to achieve a compact yet multifunctional devices. However, this …