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From the future Si technology perspective: Challenges and opportunities
K Kim - 2010 International Electron Devices Meeting, 2010 - ieeexplore.ieee.org
As silicon technology enters sub-20nm nodes, new materials, structures and processes are
being introduced in order to continue with the advantages of dimensional scaling, eg, 3D …
being introduced in order to continue with the advantages of dimensional scaling, eg, 3D …
Integrated circuit packaging review with an emphasis on 3D packaging
A Lancaster, M Keswani - Integration, 2018 - Elsevier
An introduction to the exciting and continuously growing topic of IC packaging is presented
herein. This review starts with a beginner's level introduction to microelectronic packaging …
herein. This review starts with a beginner's level introduction to microelectronic packaging …
Secure interposer-based heterogeneous integration
Secure Interposer-Based Heterogeneous Integration Page 1 156 2168-2364/22©2022 IEEE
Copublished by the IEEE CEDA, IEEE CASS, IEEE SSCS, and TTTC IEEE Design&Test …
Copublished by the IEEE CEDA, IEEE CASS, IEEE SSCS, and TTTC IEEE Design&Test …
3-D integration and through-silicon vias in MEMS and microsensors
Z Wang - Journal of Microelectromechanical Systems, 2015 - ieeexplore.ieee.org
After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …
[BOOK][B] Metrology and Diagnostic Techniques for Nanoelectronics
Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
Fabrication of high aspect ratio, non-line-of-sight vias in silicon carbide by a two-photon absorption method
JE Payne, P Nyholm, R Beazer, J Eddy… - Scientific Reports, 2024 - nature.com
The future of Moore's Law for high-performance integrated circuits (ICs) is going to be driven
more by advanced packaging and three-dimensional (3D) integration than by simply …
more by advanced packaging and three-dimensional (3D) integration than by simply …
Security and vulnerability implications of 3D ICs
Physical limit of transistor miniaturization has driven chip design into the third dimension. 3D
integration technology emerges as a viable option to improve chip performance and …
integration technology emerges as a viable option to improve chip performance and …
TSV antennas for multi-band wireless communication
On-chip wireless links offer improved network performance due to long distance
communication, additional bandwidth, and broadcasting capabilities of antennas. This work …
communication, additional bandwidth, and broadcasting capabilities of antennas. This work …
Post-bond testing of 2.5 D-SICs and 3D-SICs containing a passive silicon interposer base
CC Chi, EJ Marinissen, SK Goel… - 2011 IEEE International …, 2011 - ieeexplore.ieee.org
Through-Silicon Vias (TSVs) enable high-density, low-latency, and low-power interconnects
for system chips that consist of multiple dies. In “2.5 D” Stacked ICs (2.5 D-SICs), multiple …
for system chips that consist of multiple dies. In “2.5 D” Stacked ICs (2.5 D-SICs), multiple …
Single-phase microfluidic cooling of 2.5 D-SICs for heterogeneous integration
A parametric study of a nonuniform pin-fin-enhanced single-phase microfluidic cooling
design for 2.5 D stacked integrated circuits (2.5 D-SICs) heterogeneous integration is …
design for 2.5 D stacked integrated circuits (2.5 D-SICs) heterogeneous integration is …