Recent advances in processing, and mechanical, thermal and electrical properties of Cu-SiC metal matrix composites prepared by powder metallurgy
The demand for advanced materials such as silicon carbide particles reinforced copper
matrix composites (Cu-SiC) is increasing due to the stringent design requirement in the …
matrix composites (Cu-SiC) is increasing due to the stringent design requirement in the …
Panorama of physico-mechanical engineering of graphene-reinforced copper composites for sustainable applications
The past decade has witnessed the substitution of monolithic metallic materials by metal-
matrix composites (MMCs) for advanced applications in aerospace, marine engineering …
matrix composites (MMCs) for advanced applications in aerospace, marine engineering …
Effect of CaF2 nanoparticles on the microstructure evolution, mechanical properties and tribological behavior of Cu-Ni alloy/cBN self-lubricating composites
This research study presents the effect of CaF 2 reinforcement on the microstructure,
mechanical and self-lubricating (SL) tribological properties of Cu-Ni alloy/cBN metal matrix …
mechanical and self-lubricating (SL) tribological properties of Cu-Ni alloy/cBN metal matrix …
Effect of powder metallurgy process and its parameters on the mechanical and electrical properties of copper-based materials: Literature review
As the world is shifting towards renewable sources of energy, the demand for copper is
increasing due to its excellent electrical and corrosion resistance properties. Although …
increasing due to its excellent electrical and corrosion resistance properties. Although …
Effect of current on the tribological behavior of Cu-Fe-P immiscible alloy produced by laser powder bed fusion
Cu-based immiscible alloys have significant potential application value in the field of
electrical contacts. This study investigated the tribological behavior of Cu-Fe-P immiscible …
electrical contacts. This study investigated the tribological behavior of Cu-Fe-P immiscible …
Mechanical, tribological and electrical properties of Cu-CNT composites fabricated by flake powder metallurgy method
Cu-CNT composites were fabricated by a flake powder metallurgy method, and their
microhardness, electrical conductivity, frictional and wear properties were investigated …
microhardness, electrical conductivity, frictional and wear properties were investigated …
An overview of friction stir processing of Cu-SiC composites: Microstructural, mechanical, tribological, and electrical properties
Copper matrix composite reinforced with SiC exhibits high electrical and thermal
conductivity, as well as superior mechanical properties, making it a potential candidate for …
conductivity, as well as superior mechanical properties, making it a potential candidate for …
Influence of nano-hybrid reinforcements on the improvement strength, thermal expansion and wear properties of Cu–SiC–fly ash nanocomposites prepared by powder …
MA Taha, MM El-Zaidia, MZ Zaki… - ECS Journal of Solid …, 2023 - iopscience.iop.org
In this study, Cu-matrix hybrid nanocomposites with varying amounts of silicon carbide (SiC)
and fly ash nano particles were created using the powder metallurgy process. To describe …
and fly ash nano particles were created using the powder metallurgy process. To describe …
[HTML][HTML] Microstructural characterization and enhanced tensile and tribological properties of Cu–SiC nanocomposites developed by high-pressure torsion
In this study, an attempt has been made to fabricate Cu–SiC nanocomposites by flake
powder metallurgy and high-pressure torsion processing techniques at room temperature …
powder metallurgy and high-pressure torsion processing techniques at room temperature …
The effects of active elements on adhesion strength of SiC/Cu interface in SiC reinforced Cu-based composite: A first-principles investigation
G Chen, S Guo, H Zhang, H **ong, L Gan - Materials Today …, 2022 - Elsevier
Abstract Application of SiC reinforced Cu-based composites has been greatly limited by the
weak interfacial bonding strength between SiC and Cu matrix. In this work, the active …
weak interfacial bonding strength between SiC and Cu matrix. In this work, the active …