A critical review on the fracture of ultra-thin photovoltaics silicon wafers
D Cheng, Y Gao - Solar Energy Materials and Solar Cells, 2024 - Elsevier
Silicon-based solar photovoltaics cells are an important way to utilize solar energy. Diamond
wire slicing technology is the main method for producing solar photovoltaics cell substrates …
wire slicing technology is the main method for producing solar photovoltaics cell substrates …
Multimode photoacoustic characterization of subsurface damage in ground thin wafers
Z Liu, B Lin, X Liang, X Ma, Y Wan - International Journal of Mechanical …, 2023 - Elsevier
A multimode photoacoustic method has been applied for evaluating the degree of
subsurface damage (SSD) in the ground silicon wafer. Mode conversion of laser-generated …
subsurface damage (SSD) in the ground silicon wafer. Mode conversion of laser-generated …
Nonlinear surface acoustic wave characterization of single crystal copper: A molecular dynamics study
Y Wan, B Lin, Z Liu, X Ma, H Jia, W Chen… - Materials Today …, 2024 - Elsevier
The elastic nonlinearity of materials causes high-amplitude surface acoustic waves (SAWs)
to experience nonlinear sharpening during propagation, potentially causing material …
to experience nonlinear sharpening during propagation, potentially causing material …
Peridynamic modeling of nonlinear surface acoustic waves propagating in orthotropic materials
Z Liu, B Lin, X Liang, X Ma, Y Wan - Ultrasonics, 2023 - Elsevier
Due to the elastic nonlinearity of the material, high-amplitude surface acoustic waves
undergo nonlinear evolution during propagation and may lead to material failure. To enable …
undergo nonlinear evolution during propagation and may lead to material failure. To enable …
A Computational Study of Solid Si Target Dynamics under ns Pulsed Laser Irradiation from Elastic to Melting Regime
The dynamic behavior of solid Si targets irradiated by nanosecond laser pulses is
computationally studied with transient, thermοmechanical three-dimensional finite element …
computationally studied with transient, thermοmechanical three-dimensional finite element …
The Fractal Analysis of Surface Crack on Silicon Wafers Sliced by Diamond Wire
T Liu, P Zhang, Y Su, Y Sun - Available at SSRN 4983388 - papers.ssrn.com
The conventional geometric theory fails to accurately describe the distribution pattern of
surface cracks, while quantitative evaluation of such cracks on silicon wafers is rarely …
surface cracks, while quantitative evaluation of such cracks on silicon wafers is rarely …