Solid-phase epitaxy

BC Johnson, JC McCallum, MJ Aziz - Handbook of Crystal Growth, 2015 - Elsevier
We review the field of solid-phase epitaxy (SPE), a crystallization process during which
atoms undergo bonding rearrangements that allow them to transfer from a metastable …

Dopant effects on solid phase epitaxy in silicon and germanium

BC Johnson, T Ohshima, JC McCallum - Journal of Applied Physics, 2012 - pubs.aip.org
The kinetics of dopant-enhanced solid phase epitaxy (SPE) are studied in amorphous
silicon (a-Si) and germanium (a-Ge) layers formed by ion implantation. Implanted Sb …

Fluorine redistribution and incorporation during solid phase epitaxy of preamorphized Si

M Mastromatteo, D De Salvador, E Napolitani… - Physical Review B …, 2010 - APS
The redistribution of fluorine during solid phase epitaxial regrowth (SPER) of preamorphized
Si has been experimentally investigated, explained, and simulated, for different F …

Strain-do** coupling dynamics in phosphorus doped Si: C formed by solid phase epitaxial regrowth

WY Woon, SH Wang, YT Chuang, MC Chuang… - Applied Physics …, 2010 - pubs.aip.org
We investigate the solid phase epitaxial regrowth (SPER) dynamics of phosphorus doped
Si: C by time resolved reflectivity and high resolution x-ray diffraction. The effect of SPER …

Hydrogen in amorphous Si and Ge during solid phase epitaxy

BC Johnson, P Caradonna, DJ Pyke, JC McCallum… - Thin Solid Films, 2010 - Elsevier
Studies into the effect of hydrogen on the kinetics of solid phase epitaxy (SPE) in amorphous
Si (a-Si) and Ge (a-Ge) are presented. During SPE, H diffuses into surface amorphous …

Atom redistribution during co-doped amorphous silicon crystallization

A Portavoce, D Mangelinck, R Simola… - Defect and Diffusion …, 2009 - Trans Tech Publ
Atom redistribution during crystallization of a B and P co-doped amorphous Si layer
produced by Si and P chemical vapor co-deposition and B implantation has been …

Maskless implants of 20 keV Ga+ in thin crystalline silicon on insulator

AM Mio, G D'Arrigo, RG Milazzo, E Rimini… - Journal of Applied …, 2013 - pubs.aip.org
A nano-sized ion beam apparatus has been used as maskless lithography to implant 20 keV
Ga+ ions into a 26 nm thick silicon crystalline film on insulator. The ion beam, with about 5 …

Physical modeling of junction processing in FDSOI devices for 20 nm node and below

B Sklénard - 2014 - theses.hal.science
Complementary metal oxide semiconductor (CMOS) device scaling involves many
technologicalchallenges in terms of junction formation. Solid phase epitaxial regrowth …

Maskless nano-implant of 20 keV Ga+ in bulk Si (1 0 0) substrates

RG Milazzo, G D'Arrigo, AM Mio, E Rimini… - Nuclear Instruments and …, 2014 - Elsevier
Abstract Multidirectional SPEG (Solid Phase Epitaxial Growth) of silicon has been
investigated in micro and nanoamorphous structures generated on a crystalline substrate by …

Physical modelling of junction fabrication processes on FDSOI substrate for the 10 nm node and below

A Payet - 2017 - theses.hal.science
The junction fabrication involve numerous technological challenges as the devices shrink.
To alleviate issues brought by the aggressive device scaling, Fully Depleted SOI substrates …