Solid-phase epitaxy
We review the field of solid-phase epitaxy (SPE), a crystallization process during which
atoms undergo bonding rearrangements that allow them to transfer from a metastable …
atoms undergo bonding rearrangements that allow them to transfer from a metastable …
Dopant effects on solid phase epitaxy in silicon and germanium
The kinetics of dopant-enhanced solid phase epitaxy (SPE) are studied in amorphous
silicon (a-Si) and germanium (a-Ge) layers formed by ion implantation. Implanted Sb …
silicon (a-Si) and germanium (a-Ge) layers formed by ion implantation. Implanted Sb …
Fluorine redistribution and incorporation during solid phase epitaxy of preamorphized Si
M Mastromatteo, D De Salvador, E Napolitani… - Physical Review B …, 2010 - APS
The redistribution of fluorine during solid phase epitaxial regrowth (SPER) of preamorphized
Si has been experimentally investigated, explained, and simulated, for different F …
Si has been experimentally investigated, explained, and simulated, for different F …
Strain-do** coupling dynamics in phosphorus doped Si: C formed by solid phase epitaxial regrowth
WY Woon, SH Wang, YT Chuang, MC Chuang… - Applied Physics …, 2010 - pubs.aip.org
We investigate the solid phase epitaxial regrowth (SPER) dynamics of phosphorus doped
Si: C by time resolved reflectivity and high resolution x-ray diffraction. The effect of SPER …
Si: C by time resolved reflectivity and high resolution x-ray diffraction. The effect of SPER …
Hydrogen in amorphous Si and Ge during solid phase epitaxy
Studies into the effect of hydrogen on the kinetics of solid phase epitaxy (SPE) in amorphous
Si (a-Si) and Ge (a-Ge) are presented. During SPE, H diffuses into surface amorphous …
Si (a-Si) and Ge (a-Ge) are presented. During SPE, H diffuses into surface amorphous …
Atom redistribution during co-doped amorphous silicon crystallization
Atom redistribution during crystallization of a B and P co-doped amorphous Si layer
produced by Si and P chemical vapor co-deposition and B implantation has been …
produced by Si and P chemical vapor co-deposition and B implantation has been …
Maskless implants of 20 keV Ga+ in thin crystalline silicon on insulator
A nano-sized ion beam apparatus has been used as maskless lithography to implant 20 keV
Ga+ ions into a 26 nm thick silicon crystalline film on insulator. The ion beam, with about 5 …
Ga+ ions into a 26 nm thick silicon crystalline film on insulator. The ion beam, with about 5 …
Physical modeling of junction processing in FDSOI devices for 20 nm node and below
B Sklénard - 2014 - theses.hal.science
Complementary metal oxide semiconductor (CMOS) device scaling involves many
technologicalchallenges in terms of junction formation. Solid phase epitaxial regrowth …
technologicalchallenges in terms of junction formation. Solid phase epitaxial regrowth …
Maskless nano-implant of 20 keV Ga+ in bulk Si (1 0 0) substrates
Abstract Multidirectional SPEG (Solid Phase Epitaxial Growth) of silicon has been
investigated in micro and nanoamorphous structures generated on a crystalline substrate by …
investigated in micro and nanoamorphous structures generated on a crystalline substrate by …
Physical modelling of junction fabrication processes on FDSOI substrate for the 10 nm node and below
A Payet - 2017 - theses.hal.science
The junction fabrication involve numerous technological challenges as the devices shrink.
To alleviate issues brought by the aggressive device scaling, Fully Depleted SOI substrates …
To alleviate issues brought by the aggressive device scaling, Fully Depleted SOI substrates …