The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …

Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …

The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or
even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect …

Nanoindentation is an important technique for probing the mechanical behavior of materials
at small length scales. In this study, nanoindentation was used to extract the elastic and …

Recently, preventing environmental pollutions, lead-free (Pb-free) solders are about to
replace tin–lead (Sn–Pb) eutectic solders. However, the mechanical properties of Pb-free …

The mechanical behavior of Sn-rich solder/Cu joints is highly sensitive to processing
variables such as solder reflow time, cooling rate, and subsequent thermal aging. In this …

Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …

In this work, TiO2 nanoparticles were successfully incorporated into Sn3. 5Ag and Sn3.
5Ag0. 7Cu solder, to synthesize novel lead-free composite solders. Effects of the TiO2 …

Power electronics modules in electric vehicles and hybrid electric vehicles, particularly those
containing next-generation power semiconductor devices such as silicon carbide and …

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …