A variety of copper foams with highly open porous walls have been successfully sculptured
using the gas evolved in an electrochemical deposition process. The pore sizes and wall …

The successful implementation of copper electroplating technology in the metallization of
electronic devices derives from the use of electrolyte additives to affect the local deposition …

Influences of forced convection during acid copper electroplating on microvia fill of printed
circuit boards were studied. The plating formula was composed of polyethylene glycol …

Superconformal electrodeposition is explained by the curvature enhanced adsorbate
coverage (CEAC) mechanism. A CEAC model is used to quantitatively explain shape …

An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using
copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler …

An acid-copper plating bath containing chloride ions, polyethylene glycol (PEG), bis (3-
sulfopropyl) disulfide (SPS), and Janus Green B (JGB) has been characterized by …

This work explores the mechanism of microvia filling by copper electroplating using a printed
circuit board (PCB) with a specific pattern design. The microvias employed in this work had …

Microvias with various diameters formed by laser ablation on a printed circuit board (PCB)
were used to investigate the filling mechanism of the microvia in copper electroplating. The …

The interactions among additives employed in acidic copper plating solution for microvia
filling are characterized by galvanostatic measurement (GM) and electron paramagnetic …

Copper bottom-up deposition in 200 nm trenches by an acid-copper sulfate with only two
additives [poly (ethylene glycol)(PEG) and is achieved. The inhibiting effect of …