A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …
Structure and properties of Sn-Cu lead-free solders in electronics packaging
M Zhao, L Zhang, ZQ Liu, MY **ong… - Science and technology …, 2019 - Taylor & Francis
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …
has attracted wide attention due to its excellent comprehensive performance and low cost. In …
A Lithium Intrusion‐Blocking Interfacial Shield for Wide‐Pressure‐Range Solid‐State Lithium Metal Batteries
X Hu, J Yu, Y Wang, W Guo, X Zhang… - Advanced …, 2024 - Wiley Online Library
Lithium garnets are considered as promising solid‐state electrolytes for next‐generation
solid‐state Li metal batteries (SSLBs). However, the Li intrusion driven by external stack …
solid‐state Li metal batteries (SSLBs). However, the Li intrusion driven by external stack …
Development of high strength Sn–0.7 Cu solders with the addition of small amount of Ag and In
Nowadays, a major concern of Sn–Cu based solder alloys is focused on continuously
improving the comprehensive properties of solder joints formed between the solders and …
improving the comprehensive properties of solder joints formed between the solders and …
Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu
AA El-Daly, A Fawzy, AZ Mohamad… - Journal of Alloys and …, 2011 - Elsevier
The near peritectic Sn–5Sb Pb-free solder alloy has received considerable attention for high
temperature electronic applications, especially on step soldering technology, flip-chip …
temperature electronic applications, especially on step soldering technology, flip-chip …
Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …
Recent advances on Sn–Cu solders with alloying elements
Nowadays, a major concern of Sn–Cu based solder alloy today is focused on continuously
improving the comprehensive properties of the solder joints formed between the solders and …
improving the comprehensive properties of the solder joints formed between the solders and …
Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn–Ag–Cu solder alloy
In this paper, we investigated the electrical resistivity of the high-Ag-content Sn–3Ag–0.5 Cu,
the low-Ag-content Sn–1Ag–0.5 Cu solder alloy, and the three quaternary solder alloys Sn …
the low-Ag-content Sn–1Ag–0.5 Cu solder alloy, and the three quaternary solder alloys Sn …
Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
M **n, X Wang, F Sun - Journal of Materials Science: Materials in …, 2022 - Springer
In this work, various Cu, Ni, Ag-microalloyed Sn–5Sb/Cu joints, ordinary Sn–5Sb/Cu joints,
and low-melting-point Sn–3Ag–0.5 Cu (SAC305)/Cu (used for comparison) were prepared …
and low-melting-point Sn–3Ag–0.5 Cu (SAC305)/Cu (used for comparison) were prepared …
Investigation of microstructure and mechanical properties of Sn-xCu solder alloys
The microstructure and mechanical properties of five binary pre-aged Sn-Cu alloys with
varying Cu contents were investigated. The Cu compositions examined varied from 1 wt% to …
varying Cu contents were investigated. The Cu compositions examined varied from 1 wt% to …