Printed conductors are the main building blocks of printed flexible electronic circuits. With
the advancement and growing demand for printed and flexible electronics, researchers are …

Smart clothing with electronic functionality is gaining greater recognition as the next-
generation electronics. The integration of electronics into textiles, aided by developments of …

Fused or sintered Cu nanoparticle structures are potential alternatives to solder for ultrafine
pitch flip chip assembly and to sintered Ag for heat sink attach in high-temperature micro …

Functionality of wearable electronics depends directly on the manufacturing process and the
reliability of the device at different conditions. Nonwoven high-density polyethylene (HDPE) …

The ability to fabricate smooth transitions between surfaces at different levels is critical for
the establishment of robust printed interconnections in flexible hybrid electronics devices. In …

Conducting traces on a flexible substrate often have to survive significant and repeated
deformation, making their fatigue resistance and the stability of it during long-term storage …

Laser sintering of interconnects printed on flexible substrate with silver nanoparticle ink is
studied as an alternative to convection oven sintering. Interconnects of 80 μ m and 250 μ m …

Abstract Flexible Hybrid Electronics (FHE) has gained considerable attentions from many
fields including wearable health and point of care, assets process and their heath …

Sintering of aerosol jet printed nano-Ag traces leads to nanoporous structures that are
macroscopically brittle, but the reduction in strain localization offered by the support of a …

Random access memory (RAM) in the form of Dual In-line Memory Modules (DIMMs) are
integral to computers. The DIMM's edge contacts insert into a motherboard connector …