[HTML][HTML] Dual full-wave formulations with radiant electric circuit element boundary conditions—Application to monopole antenna modeling

G Ciuprina, D Ioan, RV Sabariego - Journal of Computational Science, 2023 - Elsevier
Abstract Electric Circuit Element (ECE) are special boundary conditions that enable a
natural coupling between electromagnetic devices and circuits. ECE can be generalized to …

Investigation of the complementarity of dual eddy current formulations on dual meshes

Z Ren, H Qu - IEEE transactions on magnetics, 2010 - ieeexplore.ieee.org
The complementary energy bounds of dual formulations on dual meshes for eddy current
problems are investigated. Based on the algebraic discretization of Maxwell equations on …

On the complementarity of dual formulations on dual meshes

Z Ren - IEEE transactions on magnetics, 2009 - ieeexplore.ieee.org
The finite element method (FEM) using Whitney elements and the finite integral technique
(FIT) using dual meshes work both with the metric free global variables. Though the …

Compact modeling and fast simulation of on-chip interconnect lines

D Ioan, G Ciuprina, M Radulescu… - IEEE Transactions on …, 2006 - ieeexplore.ieee.org
An efficient methodology to extract compact models for microstrip lines on lossy silicon
substrate is presented. The transversal magnetic field equations are solved by dual finite …

Reduced order models of on-chip passive components and interconnects, workbench and test structures

D Ioan, G Ciuprina - Model Order Reduction: Theory, Research Aspects …, 2008 - Springer
The models of passive components have to describe all relevant electromagnetic field
effects at high frequency encountered inside these devices. These effects are quantified by …

Implementation and validation of the dual full-wave E and H formulations with electric circuit element boundary conditions

G Ciuprina, D Ioan, RV Sabariego - International Conference on Scientific …, 2022 - Springer
Dual full-wave (FW) frequency-domain E and H formulations, with scalar potentials on the
boundary, and with electric circuit element boundary conditions are discussed and details …

Absorbing boundary conditions for compact modeling of on‐chip passive structures

D Ioan, G Ciuprina, M Radulescu - COMPEL-The international journal …, 2006 - emerald.com
Purpose–The paper has the purpose of proposing a new open boundary condition to be
used in conjunction with the finite integration technique (FIT) for the modelling of passive on …

Reduced order models for HF interconnect over lossy semiconductor substrate

D Ioan, G Ciuprina, S Kula - 2007 IEEE Workshop on Signal …, 2007 - ieeexplore.ieee.org
The paper describes an effective procedure to extract the reduced order models of multi-wire
on-chip interconnects. These models take into consideration effects of the high frequency …

Algebraic sparsefied partial equivalent electric circuit (ASPEEC)

D Ioan, G Ciuprina, M Rǎdulescu - Scientific Computing in Electrical …, 2006 - Springer
Due to the increase of the operation frequency and the down-scaling of the on-chip size, the
parasitic effects of the electromagnetic field cannot be neglected any longer in the design of …

[PDF][PDF] ALLROM strategy for Order Reduction of On-chip Passive Structures at High Frequencies

G Ciuprina, D Ioan - 2004 - elth.pub.ro
In order to solve a complex problem such as the electromagnetic field analysis in integrated
circuits, a series of idealizations have to be considered. Their main goal is to reduce the …