Interfacial thermal resistance: Past, present, and future

J Chen, X Xu, J Zhou, B Li - Reviews of Modern Physics, 2022 - APS
Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

Thermal conductivity of amorphous materials

WX Zhou, Y Cheng, KQ Chen, G **e… - Advanced Functional …, 2020 - Wiley Online Library
Thermal conductivity is one of the most fundamental properties of solid materials. The
thermal conductivity of ideal crystal materials has been widely studied over the past …

Phase Engineered CuxS–Ag2S with Photothermoelectric Activity for Enhanced Multienzyme Activity and Dynamic Therapy

P Zang, C Yu, R Zhang, D Yang, S Gai, B Liu… - Advanced …, 2024 - Wiley Online Library
The insufficient exposure sites and active site competition of multienzyme are the two main
factors to hinder its therapeutic effect. Here, a phase‐junction nanomaterial (amorphous …

Multilevel structure carbon aerogels with 99.999% electromagnetic wave absorptivity at 1.8 mm and efficient thermal stealth

X Chen, Z Wang, M Zhou, Y Zhao, S Tang… - Chemical Engineering …, 2023 - Elsevier
Given the complex practical environment and application fields, it is urgent to integrate
various functions into one material. Based on the introduction of nano-sites, the creation of …

Highly efficient photothermal conversion and water transport during solar evaporation enabled by amorphous hollow multishelled nanocomposites

X Chen, N Yang, Y Wang, H He, J Wang… - Advanced …, 2022 - Wiley Online Library
Solar evaporation, which enables water purification without consuming fossil fuels, has been
considered the most promising strategy to address global scarcity of drinkable water …

A review of experimental and computational advances in thermal boundary conductance and nanoscale thermal transport across solid interfaces

A Giri, PE Hopkins - Advanced Functional Materials, 2020 - Wiley Online Library
Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

Ultralow thermal conductivity of two-dimensional metal halide perovskites

A Giri, AZ Chen, A Mattoni, K Aryana, D Zhang, X Hu… - Nano …, 2020 - ACS Publications
We report on the thermal conductivities of two-dimensional metal halide perovskite films
measured by time domain thermoreflectance. Depending on the molecular substructure of …

Ultrafast and nanoscale energy transduction mechanisms and coupled thermal transport across interfaces

A Giri, SG Walton, J Tomko, N Bhatt, MJ Johnson… - ACS …, 2023 - ACS Publications
The coupled interactions among the fundamental carriers of charge, heat, and
electromagnetic fields at interfaces and boundaries give rise to energetic processes that …

Enhanced thermal boundary conductance across GaN/SiC interfaces with AlN transition layers

R Li, K Hussain, ME Liao, K Huynh… - … applied materials & …, 2024 - ACS Publications
Heat dissipation plays a crucial role in the performance and reliability of high-power GaN-
based electronics. While AlN transition layers are commonly employed in the heteroepitaxial …

Progress in the semiconductor/diamond heterogeneous integrations: Technical methods, interfacial phonon transport, and thermal characterizations

X Zhao, W Hu - Surfaces and Interfaces, 2024 - Elsevier
Excellent physical properties of wide and ultrawide bandgap semiconductor materials have
significantly advanced the miniaturization of high-power devices, radio frequency devices …