Structure and properties of lead-free solders bearing micro and nano particles
L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
M **ong, L Zhang - Journal of materials science, 2019 - Springer
During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …
the performance and reliability of electronic products. A thin and continuous intermetallic …
Microstructure, mechanical properties, and deformation behavior of Sn–1.0 Ag–0.5 Cu solder after Ni and Sb additions
Minor alloying addition to solders has been an important strategy to improve the integrity
and reliability of Pb-free solders joint. In this study, the effects of 0.06 Ni and 0.5 Sb additives …
and reliability of Pb-free solders joint. In this study, the effects of 0.06 Ni and 0.5 Sb additives …
[HTML][HTML] Effect of nanoparticles on creep behaviour of metals: a review
High-temperature resistant material is becoming increasingly significant in numerous
industrial applications, including aerospace and automotive use, to increase fuel efficiency …
industrial applications, including aerospace and automotive use, to increase fuel efficiency …
A critical review on performance, microstructure and corrosion resistance of Pb-free solders
In the quest for viable alternatives to lead-based solders, electronic industries have started
to focus on several potential lead-free solder alloys. After reviewing more than 100 recent …
to focus on several potential lead-free solder alloys. After reviewing more than 100 recent …
Properties and Microstructures of Sn‐Ag‐Cu‐X Lead‐Free Solder Joints in Electronic Packaging
L Sun, L Zhang - Advances in Materials Science and …, 2015 - Wiley Online Library
SnAgCu solder alloys were considered as one of the most popular lead‐free solders
because of its good reliability and mechanical properties. However, there are also many …
because of its good reliability and mechanical properties. However, there are also many …
Microstructure and mechanical properties of Pb-free Sn–3.0 Ag–0.5 Cu solder pastes added with NiO nanoparticles after reflow soldering process
S Chellvarajoo, MZ Abdullah - Materials & Design, 2016 - Elsevier
Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …
Investigation of microstructure and wetting behavior of Sn–3.0 Ag–0.5 Cu (SAC305) lead-free solder with additions of 1.0 wt% SiC on copper substrate
The current investigation was conducted to understand the effect of 1wt.% silicon carbide
(SiC) in the Sn–3.5 Ag–0.5 Cu (SAC305) lead-free solder alloy which was produced by the …
(SiC) in the Sn–3.5 Ag–0.5 Cu (SAC305) lead-free solder alloy which was produced by the …
Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy
AA El-Daly, GS Al-Ganainy, A Fawzy, MJ Younis - Materials & Design, 2014 - Elsevier
Abstract Nano-sized, non-reacting, non-coarsening SiC particles were successfully
fabricated by high energy ball milling. Mechanically mixing was adopted to prepare SiC …
fabricated by high energy ball milling. Mechanically mixing was adopted to prepare SiC …
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …