Being an unconventional technique of additive micro-manufacturing, electroforming has
garnered significant interest from various industrial sectors because of its capability to offer …

Abstract Highly (111)-oriented nanotwinned Ag (nt-Ag) is a promising candidate for a next-
generation direct metal bonding material without a vacuum environment. However …

Metal electrodeposition has been a subject of extensive research and has found widespread
industrial applications for centuries. The use of liquid ionic electrolyte systems has become a …

Electroforming allows for the precise fabrication of Ni-Co alloy mold but encounters
challenges with uneven thickness and persistent internal stress, which impact the mold's …

Electroforming of submillimeter scale array structures holds great promise for a wide range
of applications in array microelectrodes, vacuum electron devices and metal molds, but poor …

Direct fabricating smooth, dense, and high-purity copper structures at the microscale is a
promising technology for portable electronic products, electronic packaging components …

Precise tooling is vital for defect-free production of micro injection moulded (μ-IM) or hot-
embossed products. The demoulding stage of such moulding and forming processes poses …

With the slowing down of Moore's Law, the continued improvement of integration density has
become increasingly challenging for traditional integrated circuits. 3D packaging technology …