In recent years, computer-based graphic knowledge has evolved and become the most
common trend. The computer-aided design would be used by the designers to generate …

Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …

The end of Dennard scaling has made all systemsenergy-constrained. For data-intensive
applications with limitedtemporal locality, the major energy bottleneck is data …

Three-dimensional (3-D) hyperintegration is an emerging technology, which vertically stacks
and interconnects multiple materials, technologies, and functional components to form …

As technology scales, interconnects have become a major performance bottleneck and a
major source of power consumption for microprocessors. Increasing interconnect costs …

The energy constraints due to the end of Dennard scaling, the popularity of in-memory
analytics, and the advances in 3D integration technology have led to renewed interest in …

Long interconnects are becoming an increasingly important problem from both power and
performance perspectives. This motivates designers to adopt on-chip network-based …

Three-dimensional integration is an emerging fabrication technology that vertically stacks
multiple integrated chips. The benefits include an increase in device density; much greater …

A new timing-driven partitioning-based placement tool for 3D FPGA integration is presented.
The circuit is first divided into layers with limited number of inter-layer vias, and then …

Aggressive technology scaling over the years has helped improve processor performance
but has caused a reduction in processor reliability. Shrinking transistor sizes and lower …