Abstract Fused Deposition Modelling (FDM), a prevalent additive manufacturing technique
utilising polymeric materials, facilitates intricate geometric customisation and rapid …

Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …

High integration development of electronics requires materials possessing excellent thermal
conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this …

Controlling heat flow is a key challenge for applications ranging from thermal management
in electronics to energy systems, industrial processing, and thermal therapy. However …

Thermal interface materials (TIMs) play a pivotal role in the transfer of heat from high‐
temperature sources, such as CPUs, to heat sinks in power electronics. The effectiveness of …

Effective heat dissipation of semiconductor devices is crucial for their extended lifespan and
operational stability, and the interface of semiconductors provides an effective window for …

Over the past few decades, significant progress has been made in micro-and nanoscale
heat transfer. Numerous computational methods have been developed to quantitatively …

The thermal properties of two-dimensional materials and their heterostructure are critical for
efficient heat dissipation in nano-devices. A good example is graphene which exhibits …

Copper alloy–tungsten (CuA-W) material combination offers high-temperature damage
resistance and excellent plasma radiation resistance. At present, there is a lack of …

Manipulating the interfacial structure is vital to enhancing the interfacial thermal
conductance (G) in Cu/diamond composites for promising thermal management …