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Understanding early failure behavior in 3D-interconnects: Empirical modeling of broadband signal losses in TSV-enabled interconnects
KJ Coakley, P Kabos, S Moreau… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
We develop an empirical model for measured frequency-dependent insertion loss (). The
model parameters are determined with a stochastic optimization implementation of the …
model parameters are determined with a stochastic optimization implementation of the …
Understanding Early Failure Behavior In 3D-Interconnects 2: Empirical Modeling of Broadband Signal Losses In TSV-Enabled Interconnects
KJ Coakley, P Kabos, S Moreau… - ECS Journal of Solid …, 2024 - iopscience.iop.org
We present empirical models for measured frequency-dependent insertion loss (| S21|) in a
prototypical through silicon via (TSV) enabled 3D-IC from Sematech for characterization of …
prototypical through silicon via (TSV) enabled 3D-IC from Sematech for characterization of …
[PDF][PDF] Understanding Early Failure Behavior In 3D-Interconnects 2: Empirical Modeling of Broadband Signal Losses In TSV-Enabled Interconnects
HC Chuang, HF Li, YS Lin - 2024 - tsapps.nist.gov
We present empirical models for measured frequency-dependent insertion loss (| S21|) in a
prototypical through silicon via (TSV) enabled 3D-IC from Sematech for characterization of …
prototypical through silicon via (TSV) enabled 3D-IC from Sematech for characterization of …
Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated …
In this paper, we present an overview of our current research focus in develo** non-
destructive metrology for monitoring reliability issues in 3D-integrated electronic systems …
destructive metrology for monitoring reliability issues in 3D-integrated electronic systems …