Nanometric cutting removes material at nanoscale and generates high-quality surfaces with
a nanometric finish. In past decades, it has thrived as a mainstream manufacturing …

Molecular dynamics (MD) simulation has enhanced our understanding about ductile-regime
machining of brittle materials such as silicon and germanium. In particular, MD simulation …

A variety of cutting tool materials are used for the contact mode mechanical machining of
components under extreme conditions of stress, temperature and/or corrosion, including …

Abstract The Glenn Research Centre of NASA, USA (www. grc. nasa. gov/WWW/SiC/, silicon
carbide electronics) is in pursuit of realizing bulk manufacturing of silicon carbide (SiC) …

To study the influence of strain rate and heat effect on the removal behavior of SiC, the
dislocation nucleation/propagation, amorphization and abrasive wear behavior are …

Using molecular dynamics (MD) simulation, this paper investigates anisotropic cutting
behaviour of single crystal silicon in vacuum under a wide range of substrate temperatures …

Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal
behaviors of SiC substrates using a fixed abrasive polishing (FAP) with randomly distributed …

Understanding the initiating and suppression mechanisms of existing defects are the key to
optimizing the ultra-precision grinding process of hard and brittle materials. This paper …

A new machining method that combines textured surface and water lubrication is proposed
in this paper to improve the friction characteristics of ground silicon carbide (SiC). The effects …

Abstract Introduction Monocrystal SiC is representative of the third generation
semiconductor materials, the efficient process technology of 6H-SiC wafer have always …