Silver (Ag) paste sintering is used as a die-bonding technology for the next generation of
power electronic modules as Ag offers a high melting temperature as well as excellent …

Thermal conductivity of a Ag sintered joint was measured using the steady-state comparison
method. The results showed that with the increasing sintering temperature, the thermal …

Compared with conventional solders, nano-silver benefits low-temperature sintering and
high-temperature service, perfectly matching the high-temperature operating environment …

In order to ensure the high-temperature reliability of device in high temperature service, a
new sintered structure layer, nano-Ag paste filling graphene reinforced Ni foam, was …

Metal-to-metal bonding is critical in modern electronics technology such as 3D-IC packaging
and automotive electronics. In this study, we applied Cu core-Ag shell nanoparticle paste …

The sintering of Ag nanostructures is a promising bonding technique for wide-bandgap
semiconductor power devices. This study aimed to investigate the substrate-dependent …

Currently, the rapid advancement of electronic information technology is driving power
devices towards higher power, greater integration, and miniaturization. However, this …

Sintered silver nanoparticles (AgNPs) reinforced by SiC particles is a new alternative
interconnection material for electronic packaging due to the advantage of its characteristics …