Co-designing electronics with microfluidics for more sustainable cooling
Thermal management is one of the main challenges for the future of electronics,,,–. With the
ever-increasing rate of data generation and communication, as well as the constant push to …
ever-increasing rate of data generation and communication, as well as the constant push to …
A comparative analysis of studies on heat transfer and fluid flow in microchannels
The extremely high rates of heat transfer obtained by employing microchannels makes them
an attractive alternative to conventional methods of heat dissipation, especially in …
an attractive alternative to conventional methods of heat dissipation, especially in …
A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
High-heat-flux removal is necessary for next-generation microelectronic systems to operate
more reliably and efficiently. Extremely high heat removal rates are achieved in this work …
more reliably and efficiently. Extremely high heat removal rates are achieved in this work …
Research and applications of drag reduction in thermal equipment: A review
W Gong, J Shen, W Dai, K Li, M Gong - … Journal of Heat and Mass Transfer, 2021 - Elsevier
Existing research on heat transfer enhancement in pipe flow shows that the improvement of
thermal performance is generally accompanied by an increase in the pressure drop, which …
thermal performance is generally accompanied by an increase in the pressure drop, which …
Numerical study on thermal and hydraulic performances of a hybrid manifold microchannel with bifurcations for electronics cooling
J Yang, K Cheng, K Zhang, C Huang, X Huai - Applied Thermal …, 2023 - Elsevier
The rapid growth in heat flux of electronic devices demands effective and energy-saving
cooling solutions. A hybrid manifold microchannel (MMC) with bifurcations is proposed in …
cooling solutions. A hybrid manifold microchannel (MMC) with bifurcations is proposed in …
Energy efficient hotspot-targeted embedded liquid cooling of electronics
Large data centers today already account for nearly 1.31% of total electricity consumption
with cooling responsible for roughly 33% of that energy consumption. This energy intensive …
with cooling responsible for roughly 33% of that energy consumption. This energy intensive …
Thermal and hydrodynamic characteristics of single-phase flow in manifold microchannels with countercurrent regions
J Zhang, J An, G **n, X Wang, J Huang, L Li… - International Journal of …, 2023 - Elsevier
Manifold microchannel heat sink is promising to dissipate high heat fluxes for electronic
devices due to its high surface to volume ratio. Traditional Z-type manifold encounters fluid …
devices due to its high surface to volume ratio. Traditional Z-type manifold encounters fluid …
Three-dimensional numerical optimization of a manifold microchannel heat sink
JH Ryu, DH Choi, SJ Kim - International journal of heat and mass transfer, 2003 - Elsevier
A three-dimensional analysis procedure for the thermal performance of a manifold
microchannel heat sink has been developed and applied to optimize the heat-sink design …
microchannel heat sink has been developed and applied to optimize the heat-sink design …
Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
A hierarchical manifold microchannel heat sink array is fabricated and experimentally
characterized for uniform heat flux dissipation over a footprint area of 5 mm× 5 mm. A 3× 3 …
characterized for uniform heat flux dissipation over a footprint area of 5 mm× 5 mm. A 3× 3 …
[HTML][HTML] CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: applications in nano-energy thermal devices
The utilize of microchannel in miniature thermal devices and microchannel heat sinks has
advanced the scientific method of heat transfer to a new level, and the fields of electronic …
advanced the scientific method of heat transfer to a new level, and the fields of electronic …