Secondary Ion Mass Spectral Imaging of Metals and Alloys

Y Shen, L Howard, XY Yu - Materials, 2024 - mdpi.com
Secondary Ion Mass Spectrometry (SIMS) is an outstanding technique for Mass Spectral
Imaging (MSI) due to its notable advantages, including high sensitivity, selectivity, and high …

Characteristics of an amorphous carbon layer as a diffusion barrier for an advanced copper interconnect

BS An, Y Kwon, JS Oh, C Lee, S Choi… - … applied materials & …, 2019 - ACS Publications
The size of the advanced Cu interconnects has been significantly reduced, reaching the
current 7.0 nm node technology and below. With the relentless scaling-down of …

Intense pulsed light annealing of solution-based indium–gallium–zinc–oxide semiconductors with printed Ag source and drain electrodes for bottom gate thin film …

CJ Moon, JW Park, YR Jang, HS Kim - Scientific Reports, 2024 - nature.com
In this study, an intense pulsed light (IPL) annealing process for a printed multi-layered
indium–gallium–zinc–oxide (IGZO) and silver (Ag) electrode structure was developed for a …

Thermodynamic route for self-forming 1.5 nm V-Nb-Mo-Ta-W high-entropy alloy barrier layer: Roles of enthalpy and mixing entropy

YT Hsiao, CH Tung, SJ Lin, JW Yeh, SY Chang - Acta Materialia, 2020 - Elsevier
This study reports a thermodynamic route for self-forming an ultrathin V-Nb-Mo-Ta-W high-
entropy alloy layer for potential use as a promising diffusion barrier. In Cu alloy films minor …

Growth chemistry and electrical performance of ultrathin alumina formed by area selective vapor phase infiltration

M Snelgrove, C McFeely, G Hughes, C Weiland… - Microelectronic …, 2022 - Elsevier
Abstract 1 The growth chemistry and electrical performance of 5 nm alumina films, fabricated
via the area-selective vapor phase infiltration (VPI) of trimethylaluminum into poly (2 …

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

A Bikarregi, S Dominguez, M Brizuela, A López… - Sensors, 2023 - mdpi.com
Reducing the economic and environmental impact of industrial process may be achieved by
the smartisation of different components. In this work, tube smartisation is presented via …

An improved three-point bending test method for the investigation of nanosecond laser dicing of ultrathin Si dies with Cu stabilization layer

MR Marks, KY Cheong, Z Hassan - Materials Characterization, 2018 - Elsevier
The sidewall fracture strength of ultrathin Si dies with frontside and backside metallization
layers cannot be determined directly from three-point bending (3PB) test. The complex 3PB …

Atomically resolved interface structures of vacuum-deposited Pt on SnO2 (110),(101), and (111)

Y Chida, N Todoroki, T Wadayama - Journal of Vacuum Science & …, 2021 - pubs.aip.org
We investigated atomically resolved interface microstructures of vacuum-deposited Pt on
SnO 2 (hkl)(hkl= 110, 101, 111; Pt/SnO 2 (hkl)) substrate surfaces. The Pt/SnO 2 (hkl) …

Characterising infiltration techniques in polymer area selective deposition

M Snelgrove - 2022 - doras.dcu.ie
The integrated circuit (IC) and the vast number of transistors that each one contains has
revolutionised how humanity lives in the 21st century. Key to the near constant progress in …

All-printed thin film transistor with a solution-based Indium-Gallium-Zinc-Oxide semiconductor and printed Ag electrodes via intense pulsed light annealing

CJ Moon, JW Park, YR Jang, HS Kim - 2023 - researchsquare.com
In this study, an intense pulsed light (IPL) annealing process for a printed multi-layered
indium-gallium-zinc-oxide (IGZO) and silver (Ag) electrode structure was developed for a …