Development of nitrogen-doped carbon aerogel-based 60 Farad, 4.5 kJ supercapacitor module

A Singh, S Bhartiya, R Singh, I Bhaumik… - Bulletin of Materials …, 2024 - Springer
Among various nano-forms, carbon being explored as electrode materials for
supercapacitor, carbon aerogels (CA) manifest several excellent features owing to their 3D …

Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu

B Wang, K Zhang, Y Gao, P Liu, B Liu… - Journal of Materials …, 2023 - Springer
The trend toward miniaturized and highly integrated chip packaging has created a pressing
need for lead-free solders with high strength, toughness, and conductivity. In this paper, we …

[HTML][HTML] A Facile Alkali-Assisted Synthesis Strategy for Hierarchical Porous Carbon Aerogels for Supercapacitors

H Yang, M Zhang, X Guan, X Shang, L Zhu, H Xu… - …, 2024 - pmc.ncbi.nlm.nih.gov
Carbon aerogels synthesized via the polymerization of resorcinol (R) and formaldehyde (F)
exhibit remarkable physiochemical properties, such as high thermal stability and excellent …

Effect of porosity on the infrared extinction properties of carbon aerogel ultrafine powders

Z Yu, W Peng, Q Liu, Y Liu, X Dai - Journal of Non-Crystalline Solids, 2024 - Elsevier
Porosity is an important factor affecting the infrared (IR) extinction performance of porous
materials. In this paper, seven kinds of bulk carbon aerogels with different porosities have …

Nanocomposites of Carbon for Supercapacitors

BK Satpathy, AK Biswal, R Barik - NanoCarbon: A Wonder Material for …, 2024 - Springer
The increasing need for electronic devices that are flexible, wearable, and hybrid has
piqued the interest of researchers and industries alike. Supercapacitors have emerged as …

Fabrication and Properties of C/Ni/Al2o3 Reinforced Sn1. 0ag0. 5cu Composite Solder

B Wang, K Zhang, Y Gao, B Liu, P Liu… - Ni/Al2o3 Reinforced Sn1 … - papers.ssrn.com
With the trends of miniaturization and high integration of electronic packaging, there has
been an urgent demand to develop lead-free solders with high strength, toughness and …