The global adoption and use of photovoltaic modules (PVMs) as the main source of energy
is the key to realising the UN Millennium Development Goals on Green Energy. The …

Accelerated degradation of solder joint interconnections in crystalline silicon photovoltaic (c-
Si PV) modules drives the high failure rate of the system operating in elevated temperatures …

The critical strain energy release rate for the solder joint fracture was measured as a function
of the strain rate and the mode ratio of loading. These data are useful in predicting the …

Solder joint fracture toughness was measured using double-cantilever-beam specimens
over a range of strain rates and mode ratios as a function of five key processing parameters …

The effects of aging time and loading rate on the mode-I fracture behavior of the lead-free
Cu/Sn-0.7 Cu solder joint was studied using double cantilever beam (DCB) specimens. The …

This paper presents a fluid/structure interaction (FSI) analysis of the effects of solder bump
shapes and input/output (I/O) counts on moulded packaging. The FSI events during the …

The mixed-mode fracture energies of copper–SAC305–copper solder joints were measured
using both an Arcan-type specimen and a double-cantilever beam (DCB) specimen. The …

Double cantilever beam (DCB) specimens of 2.5‐mm‐long SAC305 solder joints were
prepared with thickness of copper adherends varying from 8 to 21 mm each. The specimens …

In this research, cohesive parameters were extracted for Sn-0.7 Cu/Cu solder joint failure.
Double cantilever beam (DCB) specimens were used to study the fracture of the joint under …

Low-silver solders are increasingly being used because silver improves the tensile strength.
In this study, the variation in fracture behavior with silver content in lead-free solder joints …