[HTML][HTML] Diffusion of n-type dopants in germanium

A Chroneos, H Bracht - Applied Physics Reviews, 2014 - pubs.aip.org
Germanium is being actively considered by the semiconductor community as a mainstream
material for nanoelectronic applications. Germanium has advantageous materials …

Kinetic Monte Carlo simulation for semiconductor processing: A review

I Martin-Bragado, R Borges, JP Balbuena… - Progress in Materials …, 2018 - Elsevier
Abstract The Kinetic Monte Carlo (KMC) algorithm is a particularly apt technique to simulate
the complex processing of semiconductor devices. In this review, some of the main …

MMonCa: An Object Kinetic Monte Carlo simulator for damage irradiation evolution and defect diffusion

I Martin-Bragado, A Rivera, G Valles… - Computer Physics …, 2013 - Elsevier
In this work, we introduce the Object Kinetic Monte Carlo (OKMC) simulator MMonCa and
simulate the defect evolution in three different materials. We start by explaining the theory of …

Breaking the do** limit in silicon by deep impurities

M Wang, A Debernardi, Y Berencén, R Heller, C Xu… - Physical Review …, 2019 - APS
n-type do** in Si by shallow impurities, such as P, As, and Sb, exhibits an intrinsic limit
due to the Fermi-level pinning via defect complexes at high do** concentrations. Here, we …

Vacancy-arsenic clusters in germanium

A Chroneos, RW Grimes, BP Uberuaga… - Applied Physics …, 2007 - pubs.aip.org
Electronic structure calculations are used to investigate the structures and relative energies
of defect clusters formed between arsenic atoms and lattice vacancies in germanium and, for …

Research on the Evolution of Defects Initiation and the Diffusion of Dopant on the Si/SiO2 Interface

Y Yang, D Chen, D Li, T Zhao, W Zhang… - Advanced Materials …, 2024 - Wiley Online Library
Si/SiO2 interfaces, important parts of Si‐based devices, significantly influence the
performance of Si‐based devices. However, owing to the impact of the external …

Microsecond non-melt UV laser annealing for future 3D-stacked CMOS

T Tabata, F Rozé, L Thuries, S Halty… - Applied Physics …, 2022 - iopscience.iop.org
Abstract Three-dimensional (3D) CMOS technology encourages the use of UV laser
annealing (UV-LA) because the shallow absorption of UV light into materials and the …

Front-end process modeling in silicon

L Pelaz, LA Marqués, M Aboy, P López… - The European Physical …, 2009 - Springer
Front-end processing mostly deals with technologies associated to junction formation in
semiconductor devices. Ion implantation and thermal anneal models are key to predict …

Arsenic uphill diffusion during shallow junction formation

M Ferri, S Solmi, A Parisini, M Bersani… - Journal of Applied …, 2006 - pubs.aip.org
The behavior during annealing of low-energy As-implanted Si have been investigated by
comparing secondary ion mass spectrometry (SIMS) and simulated profiles. Z-contrast …

[HTML][HTML] Defect behavior during growth of heavily phosphorus-doped Czochralski silicon crystals. I. Experimental study

M Hourai, Y Narushima, K Torigoe, N Nonaka… - Journal of Applied …, 2024 - pubs.aip.org
This report (I) aims to investigate defect behavior during the growth of heavily phosphorus
(P)-doped Czochralski silicon (HP-Cz-Si) crystals. The defects and P chemical states in as …