[HTML][HTML] Diffusion of n-type dopants in germanium
Germanium is being actively considered by the semiconductor community as a mainstream
material for nanoelectronic applications. Germanium has advantageous materials …
material for nanoelectronic applications. Germanium has advantageous materials …
Kinetic Monte Carlo simulation for semiconductor processing: A review
Abstract The Kinetic Monte Carlo (KMC) algorithm is a particularly apt technique to simulate
the complex processing of semiconductor devices. In this review, some of the main …
the complex processing of semiconductor devices. In this review, some of the main …
MMonCa: An Object Kinetic Monte Carlo simulator for damage irradiation evolution and defect diffusion
In this work, we introduce the Object Kinetic Monte Carlo (OKMC) simulator MMonCa and
simulate the defect evolution in three different materials. We start by explaining the theory of …
simulate the defect evolution in three different materials. We start by explaining the theory of …
Breaking the do** limit in silicon by deep impurities
n-type do** in Si by shallow impurities, such as P, As, and Sb, exhibits an intrinsic limit
due to the Fermi-level pinning via defect complexes at high do** concentrations. Here, we …
due to the Fermi-level pinning via defect complexes at high do** concentrations. Here, we …
Vacancy-arsenic clusters in germanium
Electronic structure calculations are used to investigate the structures and relative energies
of defect clusters formed between arsenic atoms and lattice vacancies in germanium and, for …
of defect clusters formed between arsenic atoms and lattice vacancies in germanium and, for …
Research on the Evolution of Defects Initiation and the Diffusion of Dopant on the Si/SiO2 Interface
Y Yang, D Chen, D Li, T Zhao, W Zhang… - Advanced Materials …, 2024 - Wiley Online Library
Si/SiO2 interfaces, important parts of Si‐based devices, significantly influence the
performance of Si‐based devices. However, owing to the impact of the external …
performance of Si‐based devices. However, owing to the impact of the external …
Microsecond non-melt UV laser annealing for future 3D-stacked CMOS
T Tabata, F Rozé, L Thuries, S Halty… - Applied Physics …, 2022 - iopscience.iop.org
Abstract Three-dimensional (3D) CMOS technology encourages the use of UV laser
annealing (UV-LA) because the shallow absorption of UV light into materials and the …
annealing (UV-LA) because the shallow absorption of UV light into materials and the …
Front-end process modeling in silicon
Front-end processing mostly deals with technologies associated to junction formation in
semiconductor devices. Ion implantation and thermal anneal models are key to predict …
semiconductor devices. Ion implantation and thermal anneal models are key to predict …
Arsenic uphill diffusion during shallow junction formation
The behavior during annealing of low-energy As-implanted Si have been investigated by
comparing secondary ion mass spectrometry (SIMS) and simulated profiles. Z-contrast …
comparing secondary ion mass spectrometry (SIMS) and simulated profiles. Z-contrast …
[HTML][HTML] Defect behavior during growth of heavily phosphorus-doped Czochralski silicon crystals. I. Experimental study
M Hourai, Y Narushima, K Torigoe, N Nonaka… - Journal of Applied …, 2024 - pubs.aip.org
This report (I) aims to investigate defect behavior during the growth of heavily phosphorus
(P)-doped Czochralski silicon (HP-Cz-Si) crystals. The defects and P chemical states in as …
(P)-doped Czochralski silicon (HP-Cz-Si) crystals. The defects and P chemical states in as …