Polymer composites with high thermal conductivity and excellent electromagnetic
interference (EMI) shielding are in high demand in modern microelectronic devices …

In this work, the percentage of polyethylene (PE) and polypropylene (PP) blend is controlled
at 50: 50 to make the composite by forming a co-continuous structure with hexagonal boron …

Thermally conductive glass fibers cloth/spherical boron nitride fillers/epoxy (GFs/BN/epoxy)
laminated composites with excellent electrical insulation properties were fabricated by …

With the growing demand for faster and more powerful computing, effective heat dissipation
is essential to ensure the longevity, reliability, and high performance of electronic systems. In …

Abstract Three-dimensional (3D) fillers are a new hotspot in the development of polymer
composites. The 3D microstructure is capable of effectively solving the agglomeration …

The graphite-reinforced epoxy resin composite (Gr/EP) is considered one of the promising
solid lubricating materials. However, the low thermal conductivity and correlated poor wear …

Flake graphite (FG) has been widely used in enhancing the thermal conductivity of polymer
composites. However, flake graphite has high aspect ratio and shows anisotropic thermal …

In this work, Polyetherketone cardo (PEK-C) was adopted to improve the mechanical and
thermal properties of the typically commercial epoxy resin. The effects of PEK-C on the …

The mechanical behaviors of honeycomb cores subjected to out-of-plane compressive
loading were studied based on the deformation of cell walls. Four types of honeycomb …

A layer-by-layer ordered-orienting hybrid network was fabricated to enhance thermal
conductivity by the size synergy of hydroxyl functionalized hexagonal boron nitride (h-BN) …