The rising requirements of computing capability with an ever-declining packaging volume
has triggered a global surge in the thermal management industry of electronic devices over …

The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

The increasing cooling demands of electronics have attracted more attention recently for
heat removal at the component with higher heat flux and heat density. Boiling, as a two …

Jet im**ement boiling is a popular thermal management technique that caters to
applications demanding very high heat dissipation rates. Like other boiling schemes, critical …

Heat sinks are considered as heat exchangers employed to cool high-temperature devices
such as electronic components. They can significantly improve heat dissipation from the …

In this review, the heat transfer characteristics of several pumped two-phase electronic
cooling technologies are quantitatively examined and compared on the basis of heat flux …

Fins or extended surfaces are generally used in heat exchangers to enhance heat transfer
between the main surface and ambient fluid. Various types of simple‐shaped fins, namely …

In this paper, an experimental study of two-phase cooling heat sink using the dielectric
working fluid Novec/HFE-7000 is performed. The liquid flow is directed into microchannel …

Metal foam has great potential for improving jet im**ement boiling heat transfer, and the
effect mechanism of metal foam structures is unclear. In this study, the boiling heat transfer …

To achieve high heat flux cooling, a distributed confined jet array im**ement boiling
device was designed and tested by using HFE-7100 as working fluid. The experimental …