With the continuous improvement of power density and integration level of power devices,
the temperature prediction of power devices becomes increasingly crucial for reliable …

Multiscale thermal analysis in integrated systems is required for capturing both device-level
and circuit-level dynamics. Traditional analysis with finite element (FE) models can be …

The aerothermal performance of the low-pressure turbine in unmanned aerial vehicles is
significantly abated at high altitude, due to boundary layer separation. Different flow control …

The high current densities in today's microelectronic devices and microchips lead to hotspot
formations and other adverse effects on their performance. Therefore, a computational tool is …

A novel coupling algorithm of the proper orthogonal decomposition (POD)–Galerkin
projection method (PGM) and the finite volume method (FVM) is developed. The proposed …

Silicon photonics (SiPho) is a promising technology for enabling low power and high-speed
optical transceivers, which are commonly used in inter/intra-data center communication …

Three algorithms that improve the performance of the asymptotically optimal Rapidly
exploring Random Tree (RRT*) are presented in this paper. First, we introduce the Goal …

Purpose–Information technology (IT) systems are already ubiquitous, and their future growth
is expected to drive the global economy for the next several decades. However, energy …

This paper studies the rapid transient thermal analysis of a packaged high power
microprocessor, forced convection cooled using a heat sink. A spatially resolved power map …

The thermal challenges that emerge from the power dissipated by the integrated circuits
inside a packaged microelectronics design play an important role in the behavior of the …