Metal silicides in CMOS technology: Past, present, and future trends

SL Zhang, M Östling - Critical Reviews in Solid State and Materials …, 2003 - Taylor & Francis
Metal silicides have played an indispensable role in the raped development of
microelectronics since PtSi was first used to improve the rectifying characteristics of diodes …

Raman study of the substrate influence on graphene synthesis using a solid carbon source via rapid thermal annealing

Y Bleu, F Bourquard, AS Loir, V Barnier… - Journal of Raman …, 2019 - Wiley Online Library
We report the results of a comparative investigation of graphene films prepared on Si (100)
and fused silica (SiO2) combining pulsed laser deposition and rapid thermal annealing …

Raman scattering characterization on SiC

H Harima - Microelectronic Engineering, 2006 - Elsevier
Raman scattering is a powerful non-contact and non-destructive characterization tool for SiC
polytypes for both the lattice and electronic properties. Here, I will briefly review two recent …

Wafer-scale few-layer graphene growth on Cu/Ni films for gas sensing applications

G Deokar, J Casanova-Cháfer, NS Rajput… - Sensors and Actuators B …, 2020 - Elsevier
Pristine, few-layer graphene (FLG)/Si nanopillar assemblies are introduced as gas sensitive
chemiresistors showing unprecedented sensitivity towards NO 2 when operated at room …

New salicidation technology with Ni (Pt) alloy for MOSFETs

PS Lee, KL Pey, D Mangelinck, J Ding… - IEEE Electron …, 2001 - ieeexplore.ieee.org
A novel salicide technology to improve the thermal stability of the conventional Ni silicide
has been developed by employing Ni (Pt) alloy salicidation. This technique provides an …

Raman study on the Ni/SiC interface reaction

E Kurimoto, H Harima, T Toda, M Sawada… - Journal of applied …, 2002 - pubs.aip.org
Ni/SiC interface reaction was investigated by Raman scattering. The specimen consisted of
a 200 nm Ni layer deposited on a both-side polished 6H–SiC wafer with postannealing at …

Surface-energy triggered phase formation and epitaxy in nanometer-thick Ni1− xPtx silicide films

J Luo, Z Qiu, C Zha, Z Zhang, D Wu, J Lu… - Applied Physics …, 2010 - pubs.aip.org
The formation of ultrathin silicide films of Ni 1− x Pt x at 450–850 C is reported. Without Pt (x=
0) and for t Ni< 4 nm⁠, epitaxially aligned NiSi 2− y films readily grow and exhibit …

Plated metal adhesion to picosecond laser-ablated silicon solar cells: Influence of surface chemistry and wettability

X Shen, PC Hsiao, B Phua, A Stokes… - Solar Energy Materials …, 2020 - Elsevier
This study investigated the influence of UV picosecond laser fluence, used to ablate the SiN
x antireflection coating for Ni/Cu/Ag plated p-type Si solar cells, on busbar and finger …

Thermal reaction of nickel and alloy

KL Pey, WK Choi, S Chattopadhyay, HB Zhao… - Journal of Vacuum …, 2002 - pubs.aip.org
The interfacial reactions and chemical phase formation between nickel and ultrahigh
vacuum chemical vapor deposited Si 0.75 Ge 0.25 alloy have been studied within the …

In situ micro-Raman analysis and X-ray diffraction of nickel silicide thin films on silicon

M Bhaskaran, S Sriram, TS Perova, V Ermakov… - Micron, 2009 - Elsevier
This article reports on the in situ analysis of nickel silicide (NiSi) thin films formed by thermal
processing of nickel thin films deposited on silicon substrates. The in situ techniques …