Methods of forming diffusion breaks on integrated circuit products comprised of finFET devices

W Zhao, H Wang, H Shen, Z Hu, MH Chi - US Patent 9,653,583, 2017‏ - Google Patents
One illustrative method disclosed herein includes, among other things, forming a first gate
structure above a fin, forming episemiconductor material on the fin, performing at least one …

Three-dimensional device and method of forming the same

J Smith, A Devilliers, K Tapily, J Grzeskowiak… - US Patent …, 2020‏ - Google Patents
(57) ABSTRACT A semiconductor device includes a plurality of first sources/drains and a
plurality of first source/drain (S/D) contacts formed over the first sources/drains. The device …

Method and device for incorporating single diffusion break into nanochannel structures of FET devices

J Smith, A Devilliers - US Patent 10,734,224, 2020‏ - Google Patents
(57) ABSTRACT A method of forming a semiconductor device includes providing a starting
structure including a substrate having thereon a plurality of gate regions alternately …

Semiconductor device and method for fabricating the same

SK Min, SK Kang, KM Ryu, GG Park - US Patent 10,128,240, 2018‏ - Google Patents
(57) ABSTRACT A semiconductor device includes a substrate including first to third regions,
wherein the third region is positioned in a first direction between the first and second …

Fin cut enabling single diffusion breaks

H Jagannathan, SK Kanakasabapathy… - US Patent …, 2017‏ - Google Patents
BACKGROUND The present disclosure relates to the electrical, electronic, and computer
arts, and, more particularly, to methods for cutting fins in the fabrication of integrated circuits …

Semiconductor device and method for fabricating the same

YW Tung, JY Wang, CT Huang… - US Patent App. 15 …, 2019‏ - Google Patents
US20190006360A1 - Semiconductor device and method for fabricating the same - Google
Patents US20190006360A1 - Semiconductor device and method for fabricating the same …

Semiconductor devices

JY Kim - US Patent 10,431,673, 2019‏ - Google Patents
ABSTRACT A semiconductor device includes a fin protruding from a substrate and
extending in a first direction, source/drain regions on the fin, a recess between the …

Semiconductor device and method for fabricating the same

IM Tseng, WA Liang, CM Huang - US Patent 9,824,931, 2017‏ - Google Patents
BACKGROUND OF THE INVENTION DETAILED DESCRIPTION 1. Field of the Invention
Referring to FIGS. 1-10, FIGS. 1-10 illustrate a method for fabricating semiconductor device …

Semiconductor devices including a device isolation region in a substrate and/or fin

DY Kwak, KB Park, KH Yeo, SJ Lee, KY Jeon… - US Patent …, 2020‏ - Google Patents
Semiconductor devices are provided. A semiconductor device includes a semiconductor
substrate. The semiconduc tor device includes first and second source/drain regions in the …

Diffusion break forming after source/drain forming and related IC structure

GR Mulfinger, JZ Wallner - US Patent 9,917,103, 2018‏ - Google Patents
Methods of forming a diffusion break are disclosed. The method includes forming a diffusion
break after source/drain formation, by removing a gate stack of the dummy gate to a buried …