Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

L Carroll, JS Lee, C Scarcella, K Gradkowski… - Applied Sciences, 2016 - mdpi.com
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si
foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to …

Review of integrated magneto-optical isolators with rare-earth iron garnets for polarization diverse and magnet-free isolation in silicon photonics

K Srinivasan, BJH Stadler - Optical Materials Express, 2022 - opg.optica.org
Passive optical isolators are needed in silicon photonics but unavailable due to challenges
in rare-earth iron garnet processing and integration. Material challenges include …

Method and system for grating couplers incorporating perturbed waveguides

L Verslegers, A Mekis - US Patent 9,091,827, 2015 - Google Patents
Methods and systems for grating couplers incorporating per turbed waveguides are
disclosed and may include in a semi conductor photonics die, communicating optical signals …

Integrated photonics including germanium

D Coolbaugh, T Adam, GL Leake - US Patent 9,864,138, 2018 - Google Patents
(57) ABSTRACT A photonic structure can include in one aspect one or more waveguides
formed by patterning of waveguiding material adapted to propagate light energy. Such …

Multi-substrate electro-optical interconnection system

A Fincato, SM Rotolo, EST Milani, M Zuffada - US Patent 9,391,708, 2016 - Google Patents
An intra-board chip-to-chip optical communications system has a high bit rate and high data
throughput based on the use of a silicon photonic interposer. The system includes a multi …

Surface coupled systems

D Mahgerefteh, J Chen, B Huebner, X Xu… - US Patent …, 2019 - Google Patents
(57) ABSTRACT A system includes a surface coupled edge emitting laser that includes a
core waveguide, a fan out region optically coupled to the core waveguide in a same layer of …

Method and system for coupling optical signals into silicon optoelectronic chips

T **uet, A Mekis, S Gloeckner - US Patent 8,280,207, 2012 - Google Patents
A method and system for coupling optical signals into silicon optoelectronic chips are
disclosed and may include coupling one or more optical signals into a back surface of a …

Integrated transmitter devices on InP exploiting electro-absorption modulation

M Baier, N Grote, M Moehrle, A Sigmund, FM Soares… - PhotoniX, 2020 - Springer
InP technology is the principal enabler for implementing fully monolithic photonic integrated
circuits (PIC), uniquely including transmitter elements. In this article we present an overview …

Photonic package architecture

EA Zarbock, D Mallik - US Patent 9,570,883, 2017 - Google Patents
Electronic components are frequently placed on a shared substrate in multi-chip modules
(“MCM). By packing a number of semiconductor devices in close proximity to each other …

Photonics interposer optoelectronics

D Coolbaugh, M Watts, M Lipson, K Bergman… - US Patent …, 2021 - Google Patents
US10976491B2 - Photonics interposer optoelectronics - Google Patents US10976491B2 -
Photonics interposer optoelectronics - Google Patents Photonics interposer optoelectronics …