Chip-level thermal management in GaN HEMT: Critical review on recent patents and inventions
The technological development of GaN high electron mobility transistor (HEMT) is on the
right track to compete with Si and SiC-based power transistors for the market segment of> …
right track to compete with Si and SiC-based power transistors for the market segment of> …
Advancements in thermal management solutions for electric vehicle high-power electronics: Innovations, cooling methods, and future perspectives
As the global market transitions from conventional to renewable energy sources, the
production of electric vehicles (EVs) has surged, presenting new challenges that require …
production of electric vehicles (EVs) has surged, presenting new challenges that require …
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation
AMM Yussof, MF Abdullah, MNAM Ridzwan… - Microelectronics …, 2024 - Elsevier
The study of chip-level and package-level heat transfer in a GaN high electron mobility
transistor (HEMT) is often disconnected due to limited resources and tools. In this work …
transistor (HEMT) is often disconnected due to limited resources and tools. In this work …
Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation
M Ridzwan, MF Abdullah, AMM Yussof, NA Aziz… - Journal of Electronic …, 2024 - Springer
The study of heat dissipation from GaN high-electron-mobility transistors (HEMT) is
important for devising an effective thermal management strategy. In this article, chip-level …
important for devising an effective thermal management strategy. In this article, chip-level …
Devices, Materials, Process Technologies, and Microelectronic Ecosystem Beyond the Exit of the Device Miniaturization Tunnel
Many innovations across the system stack–from algorithms and architectures to circuits,
devices, fabrication processes, and materials–will provide large synergistic benefits at the …
devices, fabrication processes, and materials–will provide large synergistic benefits at the …
The Utilization of Graphene and Hexagonal Boron Nitride Hybrids in Thermally Conductive Composites
PR Galligan - 2023 - search.proquest.com
The 2-dimensional materials graphene and hexagonal boron nitride (hBN) both have
extremely high thermal conductivities, with graphene being significantly better than hBN but …
extremely high thermal conductivities, with graphene being significantly better than hBN but …