Bringing dies closer by die-to-die interconnection is a way that reduces latency and energy
per bit transmitted, while increasing bandwidth per mm of chip. Heterogeneous integration …

Large grain sizes can be achieved by abnormal grain growth (AGG), but its application in Cu
interconnect is limited due to the demand for high temperatures. In this study, we found that …

In this study, we present first-principles calculations that introduce a nonvolatile spin field
effect transistor (spin-FET) utilizing a van der Waals multiferroic heterostructure, specifically …

Technological advancements and the emphasis on reducing the use of hazardous
materials, such as Pb, have led to the widely use of Sn-based Pb-free solder in advanced …

Recent discovery of ultrathick MoSi2N4 (MoN) n monolayers open up an exciting platform to
engineer two‐dimensional (2D) material properties via intercalation architecture. In this …

The void-free filling of microvia through copper electronic plating in printed circuit board
application relies critically on multi-component additives including suppressor, accelerator …

The behavior of recrystallization and grain growth was examined in Cu-Cu joints during
electromigration at 150° C. Recrystallization and grain growth were observed in all the joints …

Abstract Ball Grid Array (BGA) packaging method has been widely used in microelectronic
devices, and electromigration (EM) in BGA is a crucial reliability issue, determining the …

This study investigates Cu single-sided solder joints using hybrid soldering (In+ Sn58Bi) at
reflow temperatures ranging from 80 to 130° C. The wetting angles of 27° at 90° C and 22° …

In this work, the effect of minor Ag addition on shear performance of ball grid array (BGA)
structure Cu/SnBi/Cu solder joints under electric current stressing was investigated. The …