Laser-induced copper deposition from aqueous and aqueous–organic solutions: State of the art and prospects of research

VA Kochemirovsky, MY Skripkin… - Russian Chemical …, 2015 - iopscience.iop.org
Abstract Information about the factors influencing laser-induced deposition of metals,
primarily copper, from aqueous and aqueous–organic solutions are generalized and …

From photoinduced electron transfer to 3D metal microstructures via direct laser writing

EH Waller, G von Freymann - Nanophotonics, 2018 - degruyter.com
We review the fundamental concepts of direct laser writing (DLW) of 3D metallic structures
via photoreduction and give an overview over the state-of-the-art. On the one hand, metallic …

[KNJIGA][B] Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, volume 2

KL Mittal - 2003 - taylorfrancis.com
This volume documents the proceedings of the Second International Symposium on
Polyimides and Other High Temperature Polymers: Synthesis, Characterization and …

Destructive-treatment-free rapid polymer-assisted metal deposition for versatile electronic textiles

Y Zhang, Y Luo, L Wang, PF Ng, H Hu… - … Applied Materials & …, 2022 - ACS Publications
Highly conductive, durable, and breathable metal-coated textiles are critical building block
materials for future wearable electronics. In order to enhance the metal adhesion on the …

Soft microreactors for the deposition of conductive metallic traces on planar, embossed, and curved surfaces

A Konda, A Rau, MA Stoller, JM Taylor… - Advanced Functional …, 2018 - Wiley Online Library
Advanced manufacturing strategies have enabled large‐scale, economical, and efficient
production of electronic components that are an integral part of various consumer products …

A new palladium-free surface activation process for Ni electroless plating on ABS plastic

X Tang, C Bi, C Han, B Zhang - Materials Letters, 2009 - Elsevier
A novel palladium-free and environmentally friendly surface activation process for Ni
electroless plating was studied. The activation was carried out by immobilizing Ni …

Copper metallization of polymers by a palladium-free electroless process

M Charbonnier, M Romand, Y Goepfert… - Surface and Coatings …, 2006 - Elsevier
Different polymer substrates were copper-plated by electroless deposition without using the
Pd-based conventional catalyst to initiate the redox reaction. The principle of the process is …

Environment-friendly Pd free surface activation technics for ABS surface

Z Shu, X Wang - Applied Surface Science, 2012 - Elsevier
An environment-friendly surface etching and activation technics for acrylonitrile–butadiene–
styrene (ABS) surface metallization were investigated as a replacement for conventional …

Using laser-induced thermal voxels to pattern diverse materials at the solid–liquid interface

LD Zarzar, BS Swartzentruber… - … Applied Materials & …, 2016 - ACS Publications
We describe a high-resolution patterning approach that combines the spatial control
inherent to laser direct writing with the versatility of benchtop chemical synthesis. By taking …

Ni direct electroless metallization of polymers by a new palladium-free process

M Charbonnier, M Romand, Y Goepfert - Surface and Coatings Technology, 2006 - Elsevier
Ni films were electrolessly deposited on the surface of different polymer substrates without
having to use the conventional palladium catalyst to initiate the redox reaction leading to …