High speed silicon wet anisotropic etching for applications in bulk micromachining: a review

P Pal, V Swarnalatha, AVN Rao, AK Pandey… - Micro and Nano …, 2021 - Springer
Wet anisotropic etching is extensively employed in silicon bulk micromachining to fabricate
microstructures for various applications in the field of microelectromechanical systems …

A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching

P Pal, K Sato - Micro and Nano Systems Letters, 2015 - Springer
Wet anisotropic etching based silicon micromachining is an important technique to fabricate
freestanding (eg cantilever) and fixed (eg cavity) structures on different orientation silicon …

[BOK][B] Foundations of nanomechanics: from solid-state theory to device applications

AN Cleland - 2013 - books.google.com
Why write another book on mechanics? There are, after all, a number of excellent texts that
describe in great detail the way classical solids behave when acted upon by static and time …

Flexible and semi-transparent silicon solar cells as a power supply to smart contact lenses

E Pourshaban, A Banerjee, A Deshpande… - ACS Applied …, 2022 - ACS Publications
Supplying electric power to wearable IoT devices, particularly smart contact lenses (SCLs),
is one of the main obstacles to widespread adoption and commercialization. In the present …

[BOK][B] Silicon wet bulk micromachining for MEMS

P Pal, K Sato - 2017 - taylorfrancis.com
Microelectromechanical systems (MEMS)-based sensors and actuators have become
remarkably popular in the past few decades. Rapid advances have taken place in terms of …

Abnormal silicon etching behaviors in nanometer-sized channels

K Koo, JH Chang, S Ji, H Choi, SH Cho, SJ Yoo… - Nano Letters, 2024 - ACS Publications
Modern semiconductor fabrication is challenged by difficulties in overcoming physical and
chemical constraints. A major challenge is the wet etching of dummy gate silicon, which …

Surface structure dependence of mechanochemical etching: Scanning probe-based nanolithography study on Si (100), Si (110), and Si (111)

C **ao, X **n, X He, H Wang, L Chen… - … applied materials & …, 2019 - ACS Publications
We employed a scanning probe-based lithography process on single-crystalline Si (100), Si
(110), and Si (111) surfaces and studied the effects of crystallographic surface structures on …

Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution

C **ao, C Deng, P Zhang, L Qian, SH Kim - Tribology International, 2020 - Elsevier
Shear-induced chemical etching reactions of single-crystalline Si (100), Si (110), and Si
(111) surfaces were studied in acidic, neutral, and basic aqueous solutions. Measuring the …

Comparison of etch characteristics of KOH, TMAH and EDP for bulk micromachining of silicon (110)

S Dutta, M Imran, P Kumar, R Pal, P Datta… - Microsystem …, 2011 - Springer
Bulk micromachining in Si (110) wafer is an essential process for fabricating vertical
microstructures by wet chemical etching. We compared the anisotropic etching properties of …

[HTML][HTML] An automated and unbiased grain segmentation method based on directional reflectance microscopy

M Wittwer, B Gaskey, M Seita - Materials Characterization, 2021 - Elsevier
Identifying individual grains from sectioned polycrystalline metals is a foundational task of
microstructure analysis. However, traditional grain segmentation methods applied to optical …